XCKU035-3FBVA676E

The XCKU035-3FBVA676E is an AMD Kintex® UltraScale™ Field Programmable Gate Array (FPGA) packaged in a 676‑ball FCBGA (27×27) surface‑mount package. It combines a high count of programmable logic resources, embedded memory, and I/O to support complex, configurable digital designs.

This device is offered in an extended grade with specified operating and supply ranges appropriate for designs that require defined thermal and voltage parameters while maintaining RoHS compliance.

Key Features

• Logic Capacity  Approximately 444,343 logic elements available for implementing custom digital functions and parallel processing pipelines.
• Embedded Memory  Approximately 19.5 Mbits of on‑chip RAM for buffering, lookup tables, and state storage.
• I/O Resources  312 I/O pins to interface with peripherals, memory, and high‑speed front‑end circuits.
• Power Supply  Core voltage supply specified between 970 mV and 1.03 V to match system power delivery and sequencing requirements.
• Package & Mounting  676‑BBGA, FCBGA package (676‑FCBGA, 27×27) in a surface‑mount form factor for compact board-level integration.
• Temperature & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Environmental Compliance  RoHS compliant to meet modern materials restrictions.

Unique Advantages

• High logic density: The ~444,343 logic elements enable large, complex designs and extensive parallelism without immediate need for additional programmable devices.
• Substantial on‑chip memory: Approximately 19.5 Mbits of embedded RAM reduces reliance on external memory for many buffering and data‑path tasks.
• Ample I/O capability: 312 I/O pins provide flexibility for interfacing multiple peripherals, sensors, or memory buses directly to the FPGA.
• Compact, board‑ready package: The 676‑FCBGA (27×27) surface‑mount package supports high‑density mounting and integration into space‑constrained PCBs.
• Defined power envelope: A narrow core voltage range (970 mV to 1.03 V) simplifies power‑system design and helps ensure predictable device operation.
• Extended grade operating range: Rated for 0 °C to 100 °C, suitable for applications where that thermal window meets system requirements while maintaining RoHS compliance.

Why Choose XCKU035-3FBVA676E?

The XCKU035-3FBVA676E positions itself as a high‑capacity Kintex UltraScale FPGA option for designs that need a large amount of programmable logic, significant embedded memory, and substantial I/O in a compact surface‑mount FCBGA package. Its defined core voltage range and extended temperature rating make it appropriate for systems that require precise electrical and thermal specifications.

This device is a fit for engineers and procurement teams targeting scalable FPGA implementations within the Kintex UltraScale family where on‑chip resources, package density, and RoHS compliance are primary selection criteria.

Request a quote or submit a sales inquiry for XCKU035-3FBVA676E to obtain pricing, lead time, and availability information.