XCKU035-2FFVA1156E

The XCKU035-2FFVA1156E is a Kintex® UltraScale™ field programmable gate array (FPGA) IC from AMD. It provides a large array of programmable logic resources, substantial on‑chip memory, and a high I/O count in a 1156‑FBGA (35×35) surface‑mount package.

Designed for FPGA‑based system designs that require extensive programmable logic, embedded memory and dense I/O, this device delivers integration and configurability while operating across an extended temperature range and RoHS‑compliant manufacturing.

Key Features

• Programmable Logic Capacity  Approximately 444,343 logic elements for implementing large-scale, custom digital logic and control functions.
• Embedded Memory  Approximately 19.5 Mbits of on‑chip RAM to support buffering, state storage, and memory‑intensive algorithms without immediate need for external memory.
• High I/O Count  520 I/Os to accommodate complex interfacing and multiple parallel data channels.
• Power Supply Range  Supported core supply range of 922 mV to 979 mV, enabling precise power planning for board designs.
• Package and Mounting  1156‑FCBGA package (35×35) in a surface‑mount form factor for compact PCB integration.
• Operating Grade and Temperature  Extended grade device rated for operation from 0 °C to 100 °C to match many commercial and embedded environments.
• Compliance  RoHS‑compliant, supporting regulatory requirements for lead‑free designs.
• Manufacturer  Produced by AMD, part of the Kintex® UltraScale™ FPGA family.

Typical Applications

• High‑density I/O systems  Use the 520 I/Os to connect multiple sensors, interfaces or parallel data lanes on complex boards.
• Logic‑intensive designs  Leverage ~444,343 logic elements to implement large custom state machines, protocol stacks, or data processing pipelines.
• On‑chip buffering and memory functions  Employ approximately 19.5 Mbits of embedded RAM for frame buffers, FIFOs, and temporary storage without relying exclusively on external memory.
• Compact surface‑mount applications  The 1156‑FCBGA package supports high‑density PCB layouts where board space and routing density are constrained.

Unique Advantages

• Substantial logic fabric: The device’s ~444,343 logic elements allow designers to consolidate multiple functions into a single FPGA, reducing component count.
• Significant on‑chip memory: Approximately 19.5 Mbits of embedded RAM supports data buffering and state retention needs without immediate external memory additions.
• Large I/O capacity: 520 I/Os enable extensive connectivity for parallel interfaces, sensor arrays, and multi‑channel systems.
• Compact package: The 1156‑FCBGA (35×35) surface‑mount package helps achieve a compact board footprint while maintaining high routing density.
• Extended operating range: Rated for 0 °C to 100 °C operation to meet a wide range of commercial and embedded deployment environments.
• RoHS‑compliant manufacturing: Supports lead‑free assembly and regulatory requirements for modern electronics supply chains.

Why Choose XCKU035-2FFVA1156E?

The XCKU035-2FFVA1156E is positioned for designs that require a combination of high logic density, substantial embedded memory, and a large number of I/Os in a compact FCBGA package. Its extended operating range and RoHS compliance make it suitable for commercial and embedded applications where integration and configurability are priorities.

Engineers and procurement teams seeking a programmable logic solution from AMD’s Kintex® UltraScale™ line will find this device appropriate for consolidating complex digital functions, implementing sizable on‑chip buffering, and supporting dense interface requirements while maintaining a compact board footprint.

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