XCKU035-2FFVA1156I

The XCKU035-2FFVA1156I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC designed for industrial applications. It combines a high-density logic fabric with a substantial on‑chip memory complement and a wide complement of I/O to support complex, configurable digital designs.

Key attributes include 444,343 logic elements, approximately 19.5 Mbits of embedded memory, 520 I/Os, and an industrial operating temperature range of −40°C to 100°C, packaged in a 1156-FCBGA (35×35) surface-mount package.

Key Features

• Core Logic 444,343 logic elements for implementing large-scale custom logic, control algorithms, and datapaths.
• Embedded Memory Approximately 19.5 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic functions.
• I/O Density 520 available I/Os to accommodate extensive external interfaces, parallel data lanes, and mixed-signal front-end connectivity.
• Package & Mounting 1156-FCBGA (35×35) package in a surface-mount form factor for compact board integration and high pin-count routing.
• Power Supply Documented supply window from 922 mV to 979 mV for core power planning and voltage rail design.
• Industrial Temperature Range Rated for operation from −40°C to 100°C, supporting deployment in temperature-challenging environments.
• Compliance RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

• Industrial Control Systems Leverages the industrial temperature rating and high logic density to implement deterministic control, sequencing, and interface aggregation in industrial equipment.
• High‑Density I/O Systems 520 I/Os enable designs that require multiple parallel interfaces, sensor arrays, or high-channel-count connectivity.
• Memory‑Intensive Logic Approximately 19.5 Mbits of embedded RAM supports buffering, FIFOs, and on‑chip data staging for streaming or packetized data paths.
• Compact, High‑Pin‑Count Designs The 1156-FCBGA (35×35) package provides a compact solution for boards that need substantial I/O and logic in a surface-mount footprint.

Unique Advantages

• High Logic Capacity: 444,343 logic elements enable implementation of complex state machines, custom accelerators, and broad logic integration on a single device.
• Significant On‑Chip Memory: Approximately 19.5 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
• Extensive I/O Count: 520 I/Os simplify system-level integration by accommodating multiple interfaces and parallel connections without external multiplexing.
• Industrial Reliability: Rated for −40°C to 100°C operation, supporting deployment in harsher environments where temperature tolerance is required.
• Compact, High‑Pin Package: The 1156-FCBGA (35×35) provides a balance of pin count and board space for high-density designs using surface-mount assembly.
• RoHS Compliant: Conforms to RoHS requirements to support environmental and manufacturing compliance needs.

Why Choose XCKU035-2FFVA1156I?

The XCKU035-2FFVA1156I positions itself as a high-capacity, industrial-grade Kintex® UltraScale™ FPGA that balances logic density, embedded memory, and I/O count within a compact FCBGA package. Its specification set supports designs that require substantial on-chip resources and robust temperature tolerance.

This device is well suited for engineering teams and procurement looking for a scalable, integrated platform for control, data-path processing, and dense I/O integration, with long-term viability supported by the Kintex UltraScale family architecture.

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