XCKU035-2FBVA676I

The XCKU035-2FBVA676I is an AMD Kintex® UltraScale™ FPGA in a 676-ball FCBGA package, supplied in a 27×27 mm footprint. It provides a high-density programmable logic fabric with substantial embedded memory and a broad operating temperature range for industrial applications.

With 444,343 logic elements and approximately 19.456 Mbits of on-chip RAM, this device targets systems that require large-scale, reconfigurable logic, significant embedded memory, and a robust industrial-grade operating range.

Key Features

• Core Logic 25,391 CLBs delivering a total of 444,343 logic elements for implementing complex digital functions and large-scale programmable designs.
• Embedded Memory Approximately 19.456 Mbits of on-chip RAM to support buffering, state storage, and data processing within the FPGA fabric.
• I/O Capacity 312 user I/O pins to interface with high-pin-count peripherals and system-level connectivity.
• Power Supply Operates from 922 mV to 979 mV supply range, enabling integration into tightly specified power domains.
• Package & Mounting 676-FCBGA (27×27 mm) package in a surface-mount form factor for compact, high-density board designs.
• Industrial Grade & Temperature Range Industrial-grade device rated for operation from −40 °C to 100 °C, supporting deployment in demanding environments.
• Regulatory Status RoHS compliant.

Typical Applications

• Industrial Control Systems — Reconfigurable logic and embedded memory enable custom control, signal conditioning, and real-time processing in factory and process automation.
• Data Processing & Acceleration — Large logic capacity and on-chip RAM support hardware acceleration and complex algorithm implementation for throughput-sensitive tasks.
• Test & Measurement Equipment — High I/O count and flexible logic resources make the device suitable for instrument control, data acquisition, and protocol handling.

Unique Advantages

• High Logic Capacity: 444,343 logic elements provide the resources needed for complex designs without immediate upscaling.
• Substantial On-Chip Memory: Approximately 19.456 Mbits of embedded RAM reduce dependence on external memory for many applications.
• Robust Industrial Operation: −40 °C to 100 °C rating supports deployment in harsh or temperature-variable environments.
• Compact, High-Density Package: 676-FCBGA (27×27) offers a balance of I/O density and board-space efficiency for space-constrained systems.
• Predictable Power Domain: Specified supply range (922 mV–979 mV) assists in precise power budgeting and thermal planning.
• Regulatory Compliance: RoHS compliance simplifies environmental and manufacturing considerations.

Why Choose XCKU035-2FBVA676I?

The XCKU035-2FBVA676I delivers a combination of large-scale programmable logic, substantial embedded memory, and industrial-grade operating range, making it a strong choice for designs that require high integration and reliability. Its 312 I/O pins and compact 676-FCBGA package enable dense system integration while supporting diverse interface requirements.

This FPGA is well suited for engineering teams building industrial control, data processing, and measurement systems that demand scalable resources, predictable power behavior, and long-term deployment capability. The device’s specifications support designs where on-chip memory, logic density, and temperature tolerance are key selection criteria.

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