XCKU035-1FFVA1156I

The XCKU035-1FFVA1156I is a Kintex® UltraScale™ Field Programmable Gate Array in a 1156-ball FCBGA package targeted for industrial applications. It combines a high count of logic elements, substantial embedded memory, and a broad I/O complement to support complex digital designs that require dense programmable logic and flexible interfacing.

This device is provided in a surface-mount 1156-FCBGA (35×35) package, supports a core supply range of 922 mV to 979 mV, and is specified for operation from −40 °C to 100 °C, aligning it with industrial temperature requirements.

Key Features

• Logic Capacity Approximately 444,343 logic elements to implement complex custom logic and accelerators.
• Embedded Memory Approximately 19.456 Mbits of on-chip RAM for buffering, data storage, and state machines.
• I/O Density 520 user I/O pins to support wide parallel interfaces, multiple high-pin-count peripherals, and flexible board-level connectivity.
• Power Supply Core voltage supply range from 922 mV to 979 mV to match system power-rail designs and regulator selections.
• Package and Mounting 1156-FCBGA (35×35) package, surface mount, providing a compact footprint for high-density board layouts.
• Temperature and Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• RoHS Compliance Environmentally compliant manufacturing with RoHS status: Compliant.

Unique Advantages

• High logic integration: The large logic-element count enables implementation of substantial custom logic and parallel processing pipelines on a single device, reducing the need for multiple FPGAs.
• Ample embedded memory: Approximately 19.456 Mbits of on-chip RAM supports local buffering and state storage, reducing external memory dependence for many designs.
• Extensive I/O resources: 520 I/Os provide flexibility for complex board-level interfacing and high-pin-count peripheral support without extensive external multiplexing.
• Industrial temperature capability: Specified operation from −40 °C to 100 °C suits deployments where extended temperature range is required.
• Compact, surface-mount FCBGA package: The 1156-FCBGA (35×35) package balances high density with a manageable PCB footprint for advanced system designs.
• Regulatory-friendly manufacturing: RoHS compliance supports environmentally conscious product development and regulatory requirements.

Why Choose XCKU035-1FFVA1156I?

The XCKU035-1FFVA1156I delivers a combination of high logic capacity, significant embedded memory, and a broad I/O complement in an industrial-grade package. These measurable attributes make it suitable for system designs that demand substantial programmable logic, substantial on-chip buffering, and robust temperature performance.

For engineers and procurement teams seeking a compact, surface-mount UltraScale™ FPGA with clear electrical and thermal specifications—core voltage range, I/O count, package type, and RoHS compliance—this part provides a concise set of capabilities to support mid-to-high complexity FPGA designs.

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