XCKU035-1FBVA900C

The XCKU035-1FBVA900C is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC provided in a 900-FCBGA (31×31) package. It delivers a high-density logic fabric with 444,343 logic elements and approximately 19.456 Mbits of embedded memory, alongside 468 user I/Os.

Specified for commercial-grade environments, the device operates from 0 °C to 85 °C and is RoHS compliant. The device’s dense logic, substantial on‑chip RAM, and large I/O count make it suitable for designs requiring integrated, programmable digital resources in a compact surface-mount package.

Key Features

• Logic Fabric – Contains 25,391 CLBs that provide a total of 444,343 logic elements for implementing complex digital functions and custom logic architectures.
• Embedded Memory – Approximately 19.456 Mbits of on‑chip RAM to support buffering, state storage, and memory-intensive logic algorithms.
• I/O Capacity – 468 general-purpose I/O pins to support high pin‑count interfaces and multiple parallel or serial connections.
• Package and Mounting – Supplied in a 900‑BBGA FCBGA (31×31) surface‑mount package for high‑density board integration.
• Power – Operates with a core supply range of 922 mV to 979 mV as specified for the device.
• Temperature and Grade – Commercial grade device rated for operation from 0 °C to 85 °C.
• Compliance – RoHS compliant for alignment with common environmental regulations.

Typical Applications

• High‑density digital systems – Use the device’s 444,343 logic elements to implement large custom logic blocks and complex digital processing functions on a single FPGA.
• I/O‑intensive interfaces – Leverage 468 I/Os for designs that require multiple parallel or multiplexed connections to sensors, memory, or external controllers.
• Embedded memory buffering – Utilize approximately 19.456 Mbits of on‑chip RAM to implement frame buffers, FIFOs, and intermediate data storage without external memory in some designs.

Unique Advantages

• High logic capacity: 444,343 logic elements enable integration of large logic functions and complex state machines within a single device.
• Significant on‑chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Large I/O count: 468 I/Os provide flexibility for multi‑lane interfaces, parallel buses, and mixed-signal front ends requiring numerous connections.
• Compact FCBGA package: 900‑BBGA (31×31) surface‑mount package allows high-density PCB designs while keeping the FPGA footprint manageable.
• Commercial temperature rating: Specified for 0 °C to 85 °C operation to match a wide range of standard electronic applications.
• RoHS compliant: Meets environmental directive requirements for materials compliance.

Why Choose XCKU035-1FBVA900C?

The XCKU035-1FBVA900C positions itself as a high‑density Kintex® UltraScale™ FPGA option that blends substantial logic capacity, considerable embedded RAM, and a large I/O complement in a compact 900‑FCBGA package. Its commercial temperature rating and RoHS compliance make it appropriate for a broad set of standard electronic products and development platforms.

This device is well suited for engineers and teams looking to consolidate complex digital functions, support extensive I/O requirements, and reduce external memory needs through significant on‑chip RAM. Its specification set supports scalable designs where integration density and I/O capability are primary considerations.

Request a quote today or submit an inquiry to our sales team to receive pricing, availability, and ordering information for the XCKU035-1FBVA900C.