XCKU035-1FBVA676C

The XCKU035-1FBVA676C is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC by AMD, supplied in a 676-FCBGA (27×27) package for surface-mount applications. It delivers high logic density and on-chip memory capacity for designs that require substantial programmable logic and I/O integration.

Key device attributes include 444,343 logic elements, approximately 19.46 Mbits of embedded memory, and 312 I/O pins. The device operates from 922 mV to 979 mV, is rated for commercial temperature use (0 °C to 85 °C), and is RoHS compliant.

Key Features

• Core Density  444,343 logic elements provide a large programmable fabric for complex digital logic and system integration.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory.
• I/O Capacity  312 general-purpose I/O pins enable extensive device interfacing and high pin-count connectivity for multi-signal systems.
• Package & Mounting  676-FCBGA (27×27) package in a surface-mount format supports compact board-level integration and high-density PCB layouts.
• Power  Specified core voltage range from 922 mV to 979 mV for the device core supply.
• Temperature & Grade  Commercial grade operation from 0 °C to 85 °C for standard temperature-range applications.
• Environmental Compliance  RoHS compliant to support regulatory and assembly requirements.

Typical Applications

• High-density digital systems  Use the device where a large number of logic elements and significant on-chip RAM are required to implement complex state machines, custom datapaths, or large LUT-based functions.
• Multi-channel I/O aggregation  Leverage 312 I/O pins to consolidate and route numerous interfaces or signals on a single programmable device.
• Embedded memory-centric designs  Employ the approximately 19.46 Mbits of embedded RAM for buffering, packet queuing, or local data stores to reduce external memory dependency.

Unique Advantages

• High logic integration: 444,343 logic elements enable implementation of large, integrated digital functions on a single FPGA, reducing the need for multiple discrete devices.
• Substantial on-chip RAM: Approximately 19.46 Mbits of embedded memory supports significant local storage and buffering, simplifying memory architecture.
• Extensive I/O count: 312 I/O pins allow broad external connectivity and flexible signal routing for complex system interfaces.
• Compact FCBGA package: 676-FCBGA (27×27) surface-mount package supports compact board designs while providing high pin density.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C aligns the device with standard commercial applications and environments.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XCKU035-1FBVA676C?

The XCKU035-1FBVA676C positions itself as a high-density Kintex® UltraScale™ FPGA suitable for designs that demand large amounts of programmable logic, significant on-chip RAM, and broad I/O capability. Its combination of 444,343 logic elements, approximately 19.46 Mbits of embedded memory, and 312 I/O pins supports consolidation of complex digital functions into a single device.

With a 676-FCBGA (27×27) surface-mount package, a narrow core voltage range (922 mV–979 mV), commercial temperature rating (0 °C–85 °C), and RoHS compliance, this FPGA is tailored for customers seeking scalable logic capacity, integrated memory resources, and high pin-count connectivity in commercially-rated applications.

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