XCKU035-1FBVA676I

The XCKU035-1FBVA676I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC supplied in a 676‑FCBGA (27×27) package. It delivers large programmable logic capacity and on-chip memory in a surface-mount, industrial‑grade device suitable for deployment across temperature‑sensitive installations.

Key device characteristics include 444,343 logic elements, approximately 19.46 Mbits of embedded memory, 312 I/O pins, a low-voltage supply window of 922 mV to 979 mV, and an industrial operating temperature range of -40°C to 100°C.

Key Features

• Core Logic 444,343 logic elements provide significant programmable capacity for complex digital designs.
• Embedded Memory Approximately 19.46 Mbits of on-chip RAM to support buffering, packet processing, and intermediate data storage.
• I/O 312 I/O pins for flexible peripheral interfacing and board-level connectivity.
• Power Device supply range specified at 922 mV to 979 mV for core power considerations and system power budgeting.
• Package & Mounting 676‑FCBGA (27×27) / 676‑BBGA package, surface mount, designed for compact board layouts.
• Temperature Range & Grade Industrial grade operation from -40°C to 100°C for use in temperature-challenging environments.
• Environmental Compliance RoHS compliant to support environmentally regulated product designs.

Unique Advantages

• High logic density: 444,343 logic elements enable implementation of large-scale FPGA designs without external logic expansion.
• Substantial on-chip memory: Approximately 19.46 Mbits of embedded RAM reduces reliance on external memory for many intermediate storage needs.
• Generous I/O count: 312 I/O pins provide flexibility for multiple interfaces and sensor or peripheral connections.
• Industrial temperature capability: Rated for -40°C to 100°C to meet demanding environmental requirements.
• Compact surface-mount package: 676‑FCBGA (27×27) package supports dense PCB designs while maintaining robust device integration.
• Regulatory readiness: RoHS compliance assists in meeting environmental and regulatory objectives.

Why Choose XCKU035-1FBVA676I?

The XCKU035-1FBVA676I positions itself as an industrial‑grade Kintex UltraScale FPGA that combines high logic capacity, measurable on‑chip memory, and a substantial I/O count in a compact 676‑FCBGA surface‑mount package. Its specified voltage range and wide operating temperature make it suitable for designs where environmental robustness and dense programmable resources are required.

This device is well suited for engineering teams and procurement focused on scalable FPGA solutions with clear, verifiable hardware characteristics and environmental compliance.

Request a quote or contact sales to obtain pricing, availability, and support for integrating the XCKU035-1FBVA676I into your next design.