XCKU025-1FFVA1156I

IC FPGA 312 I/O 1156FCBGA
Part Description

Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 312 13004800 318150 1156-BBGA, FCBGA

Quantity 438 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1156-BBGA, FCBGANumber of I/O312Voltage922 mV - 979 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs18180Number of Logic Elements/Cells318150
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13004800

Overview of XCKU025-1FFVA1156I – Kintex® UltraScale™ FPGA, 1156-FCBGA

The XCKU025-1FFVA1156I is a Kintex® UltraScale™ Field Programmable Gate Array (FPGA) in a 1156-FCBGA (35×35) package designed for surface-mount applications. It delivers a substantial programmable-logic capacity and on-chip memory suitable for industrial designs that require flexible hardware acceleration and high-density I/O.

This industrial-grade device combines high logic element count, embedded memory, and a wide operating temperature range to support robust, long-life deployments in demanding environments.

Key Features

  • Device Family Kintex® UltraScale™ FPGA field programmable device for customizable hardware implementations.
  • Logic Capacity Approximately 318,150 logic elements to implement complex digital functions and custom accelerators.
  • Embedded Memory Approximately 13 Mbits of embedded memory (13,004,800 total RAM bits) for data buffering, FIFOs, and on-chip storage.
  • I/O Count 312 user I/O pins to interface with peripherals, sensors, and external devices.
  • Power Supply Core voltage supply range of 922 mV to 979 mV for defined power sequencing and integration.
  • Package & Mounting 1156-FCBGA (35×35) package in a surface-mount format suitable for compact board layouts.
  • Temperature & Grade Industrial-grade device rated for an operating temperature range of −40 °C to 100 °C.
  • Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

  • Industrial Control and Automation Use the programmable logic and wide temperature range to implement motion control, I/O aggregation, and custom protocol bridging in industrial equipment.
  • Communications Infrastructure Leverage the device’s logic capacity and I/O density for packet processing, interface adaptation, and network building blocks.
  • Test & Measurement Employ on-chip memory and high logic density for real-time data capture, signal processing, and custom measurement functions.

Unique Advantages

  • Significant Logic Resources: Approximately 318,150 logic elements enable complex designs and hardware acceleration without immediate moves to larger devices.
  • Built-in Memory Capacity: Approximately 13 Mbits of embedded memory supports buffering and local data processing to reduce external memory dependency.
  • High I/O Count: 312 I/O pins provide flexibility for dense peripheral connectivity and multi-channel interfaces.
  • Industrial Temperature Range: Rated from −40 °C to 100 °C to support operation in harsh or variable environments.
  • Compact Surface-Mount Package: 1156-FCBGA (35×35) package enables space-efficient board designs while maintaining high pin count.
  • RoHS Compliance: Meets common environmental requirements for modern manufacturing and deployment.

Why Choose XCKU025-1FFVA1156I?

The XCKU025-1FFVA1156I positions itself as a capable, industrial-grade Kintex UltraScale FPGA that balances logic capacity, embedded memory, and I/O density in a compact surface-mount FCBGA package. Its specified core voltage range and wide operating temperature make it suitable for designs that require reliable, long-term operation in industrial environments.

Engineers and procurement teams looking for a programmable platform that supports complex logic, substantial on-chip RAM, and broad interfacing options will find this device well suited for mid- to high-density FPGA applications where robustness and integration matter.

Request a quote or submit a pricing inquiry to evaluate XCKU025-1FFVA1156I for your next design or production run.

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