XCDAISY-FF1924

The XCDAISY-FF1924 is listed as a Field Programmable Gate Array (FPGA) device manufactured by AMD and categorized under FPGAs (Field Programmable Gate Array) – WC Import. The device is supplied in a surface-mount form factor and is RoHS compliant.

Documentation associated with this part includes extracted content from a Device Package User Guide (UG112, v3.7) describing package and thermal guidance. Use the available package documentation when planning PCB integration and thermal management for this surface-mount FPGA.

Key Features

• Device Type  Field Programmable Gate Array (FPGA), suitable for designs that require configurable digital logic.
• Manufacturer  AMD — part number XCDAISY-FF1924 as provided in product data.
• Mounting Type  Surface mount — designed for PCB surface-mount assembly workflows.
• Environmental Compliance  RoHS compliant, meeting common lead-free environmental requirements.
• Documentation  Datasheet content includes Device Package User Guide (UG112, v3.7) material covering packaging and related considerations.
• Package Details  Package case and supplier device package are not specified in the available product data; consult the provided package documentation for integration guidance.
• Image  Product image not available in the provided resources.

Typical Applications

• Prototyping and Development  Programmable logic prototyping where a reconfigurable FPGA is needed for iterative hardware validation and testing.
• Custom Digital Logic  Implementing application-specific digital functions and glue logic through reconfigurable hardware.
• Interface Bridging  Using FPGA fabric to translate or bridge between disparate digital interfaces in a system design.

Unique Advantages

• RoHS-compliant component: Ensures adherence to common environmental regulations for lead-free assemblies.
• Surface-mount packaging: Enables compact PCB layouts and compatibility with standard SMT assembly processes.
• Manufacturer identification: Supplied by AMD, with the part listed explicitly as XCDAISY-FF1924 for procurement and BOM references.
• Package guidance available: Extracted device package user guide (UG112) content accompanies the product data to support PCB integration and thermal planning.
• Flexible programmable logic: As an FPGA category device, it supports configurable digital implementations to adapt across multiple design needs.

Why Choose XCDAISY-FF1924?

XCDAISY-FF1924 is positioned as a surface-mount FPGA option from AMD that combines the flexibility of programmable logic with RoHS-compliant construction. The included device package guidance helps engineers address packaging and thermal considerations during board-level integration.

This part is appropriate for teams and projects that require configurable digital logic in a surface-mount component. For designs where package selection, PCB footprint, and thermal planning are key, the supplied documentation should be consulted to ensure proper integration.

If you need pricing, lead-time, or a formal quote for XCDAISY-FF1924, request a quote or submit an inquiry referencing the part number and your quantity requirements.