XCAU25P-2SFVB784E

The XCAU25P-2SFVB784E is an Artix® UltraScale+ field programmable gate array (FPGA) supplied in a 784-FCBGA (23×23) package. It delivers high-density programmable logic with substantial embedded memory and a large I/O count for designs that require on-chip integration of complex digital functions.

Key on-device resources include approximately 308,437 logic elements, roughly 11.01 Mbits of embedded memory, 17,625 configurable logic blocks (CLBs), and 304 I/O. The device is offered in an extended grade with a specified operating range of 0 °C to 100 °C and a core supply range of 825 mV to 876 mV.

Key Features

• Core Logic: Approximately 308,437 logic elements and 17,625 configurable logic blocks (CLBs) provide substantial on-chip programmable logic capacity for complex designs.
• Embedded Memory: Approximately 11.01 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic functions without immediate need for external memory.
• I/O Density: 304 general-purpose I/O pins enable dense external connectivity for buses, peripherals, and I/O-rich applications.
• Power Supply: Core voltage specified between 825 mV and 876 mV for defined power planning and supply design.
• Package & Mounting: 784-FCBGA (23×23) BFBGA package, surface-mount mounting type for compact board-level integration.
• Temperature & Grade: Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Regulatory Compliance: RoHS compliant, meeting common environmental elimination requirements.

Typical Applications

• Programmable Logic Integration: Use where high on-chip logic and memory resources are required to consolidate functions into a single FPGA.
• High-Density I/O Systems: Suitable for boards and modules that require dozens to hundreds of external signals thanks to 304 available I/O pins.
• Embedded Memory-Dependent Designs: Systems that need significant on-chip RAM for buffering, lookup tables, or state machines can take advantage of approximately 11.01 Mbits of embedded memory.

Unique Advantages

• Large Logic Capacity: Approximately 308,437 logic elements support complex, integrated digital designs and reduce reliance on multiple discrete logic devices.
• Significant On-Chip Memory: About 11.01 Mbits of embedded RAM enables substantial local storage for performance-sensitive functions and minimizes external memory dependencies.
• High I/O Count: 304 I/O pins provide flexibility for interfacing with multiple peripherals, sensors, and high-pin-count connectors.
• Compact BGA Packaging: The 784-FCBGA (23×23) package allows high-density integration while maintaining a defined footprint for board-level design.
• Clear Power Envelope: A specified core supply range of 825 mV to 876 mV simplifies power-supply selection and thermal planning.
• Environmentally Compliant: RoHS compliance supports environmental and regulatory requirements for many production programs.

Why Choose XCAU25P-2SFVB784E?

The XCAU25P-2SFVB784E positions itself as a high-density Artix® UltraScale+ FPGA option that balances substantial programmable logic, embedded memory, and abundant I/O in a 784-FCBGA package. Its extended-grade temperature range and defined core voltage specifications make it suitable for designs that require predictable electrical and thermal planning.

This device is well suited to engineering teams looking to consolidate complex logic and memory on-chip, reduce bill-of-materials complexity, and leverage a dense BGA package for space-constrained PCBs. RoHS compliance further supports broader production and procurement requirements.

Request a quote or submit an inquiry to obtain pricing and availability for the XCAU25P-2SFVB784E.