XCAU25P-1SFVB784I

The XCAU25P-1SFVB784I is an Artix® UltraScale+ field programmable gate array (FPGA) IC from AMD, supplied in a 784-ball FCBGA package. It delivers high integration with a large complement of logic resources, embedded memory and I/O to support complex digital designs.

This device provides approximately 308,437 logic elements and approximately 11.01 Mbits of embedded memory, along with 304 I/O pins. It is specified for industrial-grade operation with a supply voltage range of 825 mV to 876 mV and an operating temperature range of -40 °C to 100 °C.

Key Features

• Core Logic  Approximately 308,437 logic elements for implementing complex, high-density digital functions.
• Embedded Memory  Total on-chip RAM of 11,010,048 bits (approximately 11.01 Mbits) for local buffering, state storage and datapath support.
• I/O Resources  304 I/O pins to support multiple external interfaces and parallel connectivity.
• Power Supply  Specified operating voltage range of 825 mV to 876 mV for core power delivery.
• Package & Mounting  Supplied in a 784-FCBGA (23×23) package; package case references include 784-BFBGA, FCBGA. Surface-mount mounting type for PCB assembly.
• Thermal & Grade  Industrial grade device with an operating temperature range from -40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Implement complex logic blocks and datapaths using the device’s ~308,437 logic elements and embedded memory.
• Memory-intensive functions  Use the approximately 11.01 Mbits of on-chip RAM for buffering, FIFOs and localized storage without large external memory dependencies.
• I/O-heavy systems  Integrate multiple interfaces and parallel buses using the 304 available I/O pins to consolidate board-level connectivity.
• Industrial-temperature deployments  Deploy in systems that require operation across -40 °C to 100 °C, leveraging the device’s industrial grade specification.

Unique Advantages

• High logic density: Consolidate multiple functions on-chip with approximately 308,437 logic elements, reducing the need for external ASICs or multiple FPGAs.
• Significant on-chip memory: Approximately 11.01 Mbits of embedded RAM supports data buffering and stateful designs without immediate external memory.
• Extensive I/O capacity: 304 I/O pins enable broad interface support and flexible board-level integration.
• Industrial temperature rating: Specified -40 °C to 100 °C operation for reliability in thermally demanding environments.
• Compact high-pin-count package: 784-FCBGA (23×23) offers dense routing and high connectivity in a surface-mount form factor.
• RoHS compliant: Meets RoHS requirements to support environmental and manufacturing compliance goals.

Why Choose XCAU25P-1SFVB784I?

The XCAU25P-1SFVB784I positions itself as a high-integration FPGA option within the Artix® UltraScale+ family, combining substantial logic resources, embedded memory and abundant I/O in a compact FCBGA package. Its industrial-grade temperature range and RoHS compliance make it suitable for robust, long-life designs that require reliable on-board digital processing and interfacing.

This device is well suited to engineers and procurement teams designing complex, high-density digital systems that need consolidated logic, local memory and extensive I/O while maintaining industrial temperature operation. Its combination of resources supports scalable designs and reduces reliance on external components.

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