XCAU20P-L1SFVB784I

The XCAU20P-L1SFVB784I is an Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC from AMD supplied in a 784‑FBGBA (FCBGA) package. This industrial‑grade, surface‑mount FPGA provides a high logic element count and multiple megabits of embedded RAM for designs that require on‑chip combinational and storage resources.

Key hardware characteristics include 238,437 logic elements, approximately 7.34 Mbits of embedded memory, 228 general I/O lines, a supply voltage range of 698 mV to 742 mV, and an operating temperature range of −40 °C to 100 °C—attributes that support dense, I/O‑rich implementations in temperature‑sensitive environments.

Key Features

• Core / Architecture  Artix® UltraScale+ FPGA architecture in an industrial‑grade device offering a large array of programmable resources.
• Logic Capacity  238,437 logic elements to implement complex combinational and sequential logic functions on‑chip.
• Configurable Logic Blocks (CLBs)  13,625 CLBs provide the structural resources for logic partitioning and floorplanning.
• Embedded Memory  Approximately 7.34 Mbits of on‑chip RAM to support buffering, FIFOs, and local data storage.
• I/O  228 available I/O pins to interface with external peripherals, sensors, and high‑density connectors.
• Power  Supports a supply voltage range of 698 mV to 742 mV for integration with low‑voltage system domains.
• Package & Mounting  784‑FCBGA package (23 × 23 mm) in a surface‑mount form factor for compact, high‑density PCB layouts.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in extended‑temperature environments.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial control and automation  Extended temperature range and industrial grade packaging make the device suitable for programmable logic in factory automation and motor control subsystems.
• High‑density embedded systems  Large logic capacity and on‑chip memory enable consolidation of complex control and preprocessing functions into a single FPGA.
• Signal processing and acceleration  Significant embedded RAM and abundant logic elements support buffering and pipeline stages for hardware acceleration tasks.
• Communication and I/O aggregation  228 I/O pins provide the physical interfaces required for aggregating multiple serial and parallel links or board‑level I/O routing.

Unique Advantages

• High logic density: 238,437 logic elements allow for large, integrated designs without immediate partitioning across multiple devices.
• Substantial on‑chip memory: Approximately 7.34 Mbits of embedded RAM reduces external memory needs for many buffering and storage tasks.
• Robust I/O capability: 228 I/O pins support extensive peripheral and board interfacing while simplifying PCB routing for dense systems.
• Industrial temperature capability: Rated from −40 °C to 100 °C to meet thermal requirements of industrial deployments.
• Compact FCBGA package: 784‑FCBGA (23 × 23 mm) provides a high‑pin‑count solution in a small footprint for space‑constrained designs.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and supply chain requirements.

Why Choose XCAU20P-L1SFVB784I?

The XCAU20P-L1SFVB784I positions itself as a high‑capacity, industrial‑grade FPGA option within the Artix UltraScale+ family, combining extensive logic resources, multi‑megabit embedded RAM, and a large I/O complement in a compact FCBGA package. These attributes make it suitable for engineers consolidating complex algorithms, data buffering, and high‑density interfacing into a single programmable device.

For design teams targeting robust, temperature‑tolerant systems with a need for on‑chip memory and abundant logic, this FPGA delivers a balanced combination of integration and physical I/O in a RoHS‑compliant, surface‑mount package.

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