XCAU20P-2SFVB784I

The XCAU20P-2SFVB784I is an Artix® UltraScale+ field programmable gate array presented in a 784-ball FCBGA package. It is offered in an industrial-grade configuration with specified supply and thermal ranges.

This device provides 238,437 logic elements and approximately 3.36 Mbits of embedded memory, supports 156 I/O, and is packaged as a 784-BFBGA (23×23) surface-mount device. Supply voltage is specified from 825 mV to 876 mV and the operating temperature range is −40 °C to 100 °C. The part is RoHS compliant.

Key Features

• Core Architecture  Artix® UltraScale+ FPGA technology in a programmable logic device.
• Logic Capacity  238,437 logic elements for dense implementation of programmable logic.
• Embedded Memory  Approximately 3.36 Mbits of on-chip RAM (3,355,443 bits) for buffering and local storage.
• I/O  156 general-purpose I/O to support external interfacing and connectivity.
• Power  Specified core supply voltage range of 825 mV to 876 mV.
• Package & Mounting  784-BFBGA FCBGA package (784-FCBGA, 23×23) with surface-mount mounting.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Unique Advantages

• Substantial logic density: 238,437 logic elements allow consolidation of complex logic into a single device.
• On-chip memory resources: Approximately 3.36 Mbits of embedded RAM reduce dependence on external memory for local buffering and state storage.
• Generous I/O count: 156 I/O pins provide flexibility for interfacing to peripherals, sensors, and board-level signals.
• Industrial-grade thermal range: Rated from −40 °C to 100 °C for deployment in environments requiring extended temperature operation.
• Compact BGA package: 784-ball FCBGA (23×23) surface-mount package balances high pin count and PCB area efficiency.
• Regulatory alignment: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XCAU20P-2SFVB784I?

The XCAU20P-2SFVB784I positions itself as a high-capacity Artix® UltraScale+ FPGA option for designs that require a large number of logic elements, significant on-chip memory, and a substantial I/O complement within a compact BGA package. Its industrial temperature rating and defined core supply range support deployment in temperature-sensitive and power-constrained applications.

This part is suitable for teams and projects seeking a programmable logic device with verified on-chip resources and clear package and electrical characteristics, enabling predictable integration and long-term design planning.

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