XCAU20P-L1FFVB676I

The XCAU20P-L1FFVB676I is an Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC designed for industrial applications. It combines a high logic capacity with embedded memory and a wide operating temperature range to address demanding system-level integration and reliability needs.

With approximately 238,437 logic elements and about 7.34 Mbits of on-chip RAM, this surface-mount FPGA in a 676-FCBGA (27×27) package is suited for applications requiring dense programmable logic, substantial embedded memory, and a clearly defined supply and thermal envelope.

Key Features

• Core Logic  Approximately 238,437 logic elements provide high-density programmable resources for custom logic and control functions.
• Embedded Memory  Approximately 7.34 Mbits of on-chip RAM supports buffering, state storage, and data processing without external memory for many use cases.
• I/O Count  228 I/Os allow broad interfacing options to peripheral devices and subsystem interconnects.
• Power Supply  Defined supply range of 698 mV to 742 mV enables predictable power budgeting and system-level power design.
• Package & Mounting  676-FCBGA (27×27) supplier device package in a surface-mount form factor for compact board-level integration.
• Temperature & Grade  Industrial-grade device rated for operation from −40°C to 100°C for deployment in temperature-challenging environments.
• Environmental Compliance  RoHS compliant, supporting regulatory and manufacturing requirements for lead-free assemblies.

Unique Advantages

• High programmable capacity: The large logic element count supports complex custom designs without immediate need for higher-tier devices.
• Significant on-chip memory: Approximately 7.34 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks, simplifying BOM and board layout.
• Clear thermal and electrical limits: Known operating range (−40°C to 100°C) and supply voltage window (698–742 mV) make system-level validation and power sequencing more deterministic.
• Compact, surface-mount packaging: The 676-FCBGA (27×27) format supports dense PCB designs while providing the pin count needed for flexible I/O mapping.
• Industrial-grade suitability: Grade designation supports deployment in industrial systems where extended temperature operation is required.
• Regulatory-ready: RoHS compliance helps streamline manufacturing and end-product regulatory alignment.

Why Choose XCAU20P-L1FFVB676I?

This Artix® UltraScale+ FPGA delivers a balanced combination of dense programmable logic, substantial embedded memory, and defined electrical and thermal characteristics tailored for industrial applications. Its surface-mount 676-FCBGA package and 228 I/Os provide the integration density and interfacing flexibility needed for compact, feature-rich systems.

Designers and procurement teams seeking a device with verifiable on-chip resources, predictable supply requirements, and an industrial operating range will find the XCAU20P-L1FFVB676I a practical choice for mid-to-high complexity FPGA applications, offering long-term value through integration and clear specification boundaries.

Request a quote or submit a quote request to obtain pricing and availability for the XCAU20P-L1FFVB676I. Our team can provide technical details and assist with lead-time and procurement requirements.