XCAU20P-2FFVB676E
| Part Description |
Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC 228 7340032 238437 676-BBGA, FCBGA |
|---|---|
| Quantity | 54 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 228 | Voltage | 825 mV - 876 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 13625 | Number of Logic Elements/Cells | 238437 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7340032 |
Overview of XCAU20P-2FFVB676E – Artix® UltraScale+ FPGA, 676-FCBGA, Extended Grade
The XCAU20P-2FFVB676E is an Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC. It combines a large programmable fabric with embedded memory and a high I/O count in a 676-FCBGA (27×27) surface-mount package.
Key on-chip resources include 238,437 logic elements, approximately 7.34 Mbits of embedded memory, and 228 I/O. The device operates from a core supply range of 0.825 V to 0.876 V and is specified for extended-grade operation from 0 °C to 100 °C.
Key Features
- Logic Fabric 238,437 logic elements provide extensive programmable resources for implementation of custom logic and state machines.
- Embedded Memory Approximately 7.34 Mbits of on-chip RAM for data buffering, packet storage, or other embedded storage needs.
- I/O Capacity 228 general-purpose I/O pins to support multiple interfaces and external peripherals.
- Power Core voltage supply specified between 0.825 V and 0.876 V for the programmable core.
- Package & Mounting 676-FCBGA package (27×27) in a surface-mount form factor for compact board-level integration.
- Operating Range & Grade Extended-grade device rated for 0 °C to 100 °C operation.
Unique Advantages
- High logic capacity: 238,437 logic elements enable substantial on-chip implementation without immediate need for external logic.
- Significant embedded memory: Approximately 7.34 Mbits of RAM supports on-device buffering and state retention to simplify system memory architecture.
- Ample I/O: 228 I/O pins accommodate multiple interfaces and external connectivity requirements.
- Compact FCBGA footprint: 676-FCBGA (27×27) package allows dense integration on modern PCB layouts while providing robust pin-count.
- Extended-grade operation: Rated 0 °C to 100 °C for applications that require wider-than-commercial temperature support.
- Low-voltage core: Narrow core supply range (0.825 V–0.876 V) enabling consistent power planning for the programmable core.
Why Choose XCAU20P-2FFVB676E?
This Artix® UltraScale+ FPGA balances large programmable resources, embedded memory, and a high I/O count within a 676-FCBGA surface-mount package. The device's extended-grade temperature range and defined core supply make it suitable for designs that require predictable environmental and power characteristics.
Engineers and designers looking for a solution with significant on-chip logic and memory capacity, consolidated I/O, and a compact package can rely on the measured specifications of the XCAU20P-2FFVB676E for system-level planning and integration.
Request a quote or submit an inquiry to receive pricing and availability information for the XCAU20P-2FFVB676E.
Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH
