XCAU20P-1SFVB784E

The XCAU20P-1SFVB784E is an Artix® UltraScale+ field programmable gate array (FPGA) IC manufactured by AMD. It provides a high-count programmable logic resource complemented by substantial on-chip memory and a large number of I/O pins, packaged in a 784‑ball FCBGA.

This device is suited for designs that require a combination of dense logic resources, embedded RAM, and a broad I/O footprint, while operating within a defined supply voltage and temperature range.

Key Features

• Core Logic 238,437 logic elements and 13,625 CLBs provide the primary programmable logic resources for custom digital designs.
• Embedded Memory Approximately 7.34 Mbits of on-chip RAM to support data buffering, state storage, and memory-intensive logic blocks.
• I/O Capacity 228 user I/O pins to interface with peripherals, sensors, and external logic.
• Power and Voltage Supported supply voltage range from 825 mV to 876 mV for core power domains.
• Package and Mounting 784‑BFBGA (supplier package: 784‑FCBGA, 23×23) in a surface-mount package for compact board-level integration.
• Temperature and Grade Extended grade operation with an operating temperature range of 0 °C to 100 °C.
• Compliance RoHS compliant.

Unique Advantages

• High logic capacity: 238,437 logic elements enable complex programmable functions and sizeable digital designs without external logic.
• Substantial on-chip RAM: Approximately 7.34 Mbits of embedded memory reduces dependency on external memory for many buffering and state-storage needs.
• Generous I/O count: 228 I/Os simplify connectivity to multiple peripherals and parallel interfaces.
• Compact BGA footprint: 784‑ball FCBGA (23×23) balances a high pin count with a space-efficient package suitable for dense PCB layouts.
• Defined low-voltage core operation: Narrow core supply window (825 mV–876 mV) supports predictable power design around the device.
• Extended temperature grade: Operation from 0 °C to 100 °C supports deployment in environments within that range.

Why Choose XCAU20P-1SFVB784E?

The XCAU20P-1SFVB784E combines a large logic element count, substantial embedded memory, and a high I/O count in a compact 784‑BFBGA package, offering a balanced platform for complex programmable designs. Its defined supply voltage range and extended temperature grade make it suitable for systems that need predictable power integration and operation within 0 °C to 100 °C.

Manufactured by AMD, this FPGA is appropriate for development teams and procurement groups looking for a high-resource FPGA option with on-chip memory and broad connectivity in a surface-mount BGA package.

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