XCAU20P-1FFVB676I

The XCAU20P-1FFVB676I is an Artix® UltraScale+ field programmable gate array from AMD supplied in a 676-FCBGA surface-mount package. It delivers a balance of programmable logic capacity, on-chip memory, and flexible I/O for industrial-grade embedded designs.

With 238,437 logic elements, approximately 3.36 Mbits of embedded RAM, and 156 I/O pins, this device targets applications that require substantial logic integration and reliable operation across an industrial temperature range.

Key Features

• Architecture Artix® UltraScale+ FPGA family device from AMD implemented in an FCBGA package to provide programmable logic in a compact surface-mount form.
• Logic Capacity 238,437 logic elements to implement complex digital functions and custom hardware accelerators.
• Embedded Memory Approximately 3.36 Mbits of on-chip RAM (3,355,443 total RAM bits) for buffering, FIFOs, and local data storage.
• I/O 156 user I/O pins to interface with sensors, peripherals, and other system components.
• Power Operates from a core supply range of 698 mV to 742 mV to meet specified power requirements.
• Package & Mounting 676-FCBGA (27×27) package, listed as 676-BBGA/FCBGA, optimized for surface-mount assembly in space-constrained designs.
• Temperature & Grade Industrial-grade device rated for operation from −40°C to 100°C, suitable for demanding environmental conditions.
• Environmental Compliance RoHS compliant.

Typical Applications

• Industrial control and automation — Use programmable logic and on-chip memory to implement control algorithms, I/O aggregation, and custom processing within industrial systems.
• Embedded system integration — Provide mid-to-high logic density and local RAM for consolidating functions that reduce external components.
• I/O-constrained designs — Leverage 156 I/Os to connect multiple peripherals, sensors, and interfaces in a single FPGA device.

Unique Advantages

• High logic density: 238,437 logic elements enable implementation of complex digital designs without external programmable devices.
• Substantial on-chip memory: Approximately 3.36 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage.
• Flexible I/O count: 156 available I/Os support a variety of peripheral connections and system interfaces.
• Industrial-ready thermal range: Rated from −40°C to 100°C to support deployment in harsh environments.
• Compact FCBGA package: 676-FCBGA (27×27) supports dense PCB layouts and surface-mount assembly.
• Regulatory compliance: RoHS compliant for environmental and manufacturing considerations.

Why Choose XCAU20P-1FFVB676I?

The XCAU20P-1FFVB676I combines a significant logic element count, meaningful on-chip RAM, and a substantial I/O complement in a compact FCBGA package designed for industrial operation. It is positioned for designers who need a programmable, integrated solution capable of implementing complex functions while meeting industrial temperature and environmental requirements.

This device is suitable for development and production designs that prioritize integration, reduced external component count, and long-term deployment in industrial settings under defined voltage and temperature conditions.

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