XCAU20P-2FFVB676I

The XCAU20P-2FFVB676I is an Artix® UltraScale+ field programmable gate array supplied in a 676-FCBGA package (27×27). It delivers a high logic-element count alongside substantial on-chip memory and a 156-pin I/O footprint, designed for industrial applications that require dense programmable logic and reliable operation across a wide temperature range.

Key electrical and mechanical characteristics include a core voltage supply range of 825 mV to 876 mV, surface-mount packaging, RoHS compliance, and an operating temperature range of -40 °C to 100 °C.

Key Features

• Logic Capacity  Offers 238,437 logic elements and approximately 13,625 logic blocks for complex programmable logic implementations.
• Embedded Memory  Approximately 3.36 Mbits of on-chip RAM to support data buffering, state storage, and intermediate processing.
• I/O Count  156 available I/O pins to support multiple interfaces and signal domains in a single device.
• Power Domain  Core supply voltage specified between 825 mV and 876 mV for defined power planning and regulator selection.
• Package & Mounting  Delivered in a 676-FCBGA (27×27) package for high-density PCB integration; surface-mount mounting type for standard assembly flows.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C to meet industrial environment requirements.
• Compliance  RoHS-compliant to meet common environmental and manufacturing standards.

Typical Applications

• Industrial Automation  Programmable control and logic consolidation where industrial-grade temperature range and robust logic density are required.
• Communications Infrastructure  Custom packet processing, protocol bridging, and interface aggregation leveraging high logic capacity and on-chip memory.
• Embedded Signal Processing  Local data buffering and parallel processing tasks that benefit from substantial embedded RAM and large logic resources.
• Custom Hardware Acceleration  Offload compute kernels or implement application-specific accelerators using the device’s logic and memory resources.

Unique Advantages

• High logic density: 238,437 logic elements enable complex designs without immediate need for multi-FPGA partitioning.
• Substantial on-chip memory: Approximately 3.36 Mbits of embedded RAM reduces dependence on external memory for many buffering and stateful tasks.
• Industrial rating: Operation from -40 °C to 100 °C supports deployment in demanding environments.
• Compact, high-density package: 676-FCBGA (27×27) provides a small footprint for high-pin-count, surface-mount implementations.
• Defined power envelope: Core voltage range of 825–876 mV supports precise power budgeting and regulator selection.
• RoHS compliant: Supports environmentally conscious manufacturing and procurement requirements.

Why Choose XCAU20P-2FFVB676I?

The XCAU20P-2FFVB676I positions itself as a capable, industrial-grade FPGA option for designers needing a combination of high logic capacity, meaningful embedded memory, and a moderate I/O count in a compact FCBGA package. Its specified operating temperature range and RoHS compliance make it suitable for long-lived industrial and infrastructure designs.

Choose this device when your project requires scalable programmable logic resources, on-chip memory for buffering or stateful processing, and a defined power and thermal envelope for robust hardware integration.

Request a quote or submit a sales inquiry to evaluate XCAU20P-2FFVB676I pricing, availability, and lead times for your next design.