XCAU20P-1SFVB784I

The XCAU20P-1SFVB784I is an Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC supplied in a 784-BFBGA / 784-FCBGA (23×23) package. It provides a substantial logic fabric with 238,437 logic elements and approximately 7.34 Mbits of embedded memory, making it suitable for designs that require high-density programmable logic and on-chip RAM.

Designed for industrial applications, this surface-mount FPGA supports an operating temperature range of −40 °C to 100 °C and a core voltage supply range of 0.825 V to 0.876 V, enabling deployment where temperature resilience and controlled core supply are required.

Key Features

• Core Logic 238,437 logic elements providing programmable logic capacity for complex digital designs.
• Configurable Logic Blocks (CLBs) 13,625 CLBs for structured implementation of combinational and sequential logic functions.
• Embedded Memory Approximately 7.34 Mbits of on-chip RAM to support packet buffering, lookup tables, and algorithmic state storage.
• I/O Density 228 I/O pins to accommodate high-density interfacing with external peripherals and subsystems.
• Power Supply Core voltage range of 0.825–0.876 V for the FPGA fabric; supports designs that require defined low-voltage core operation.
• Package and Mounting 784-BFBGA / 784-FCBGA (23×23) package in a surface-mount format for compact board-level integration.
• Industrial Temperature Grade Rated for −40 °C to 100 °C operating temperature and designated industrial grade for use in temperature-demanding environments.
• Environmental Compliance RoHS compliant, meeting common environmental regulatory requirements.

Typical Applications

• Industrial Control and Automation Industrial-grade temperature rating and high logic capacity support motor control, PLC functions, and factory automation logic.
• High-Density I/O Systems 228 I/O pins enable complex sensor, actuator, and interface aggregation on a single FPGA platform.
• Memory-Intensive Logic Approximately 7.34 Mbits of embedded RAM is suitable for buffering, data staging, and stateful processing within embedded systems.

Unique Advantages

• Significant Logic Capacity: 238,437 logic elements and 13,625 CLBs allow implementation of large, integrated custom logic functions without immediate need for external ASICs.
• On-Chip Memory: Approximately 7.34 Mbits of embedded RAM reduces dependence on external memory for many buffering and LUT requirements.
• High I/O Count: 228 I/O pins enable direct interfacing to multiple peripherals and high-pin-count subsystems, simplifying board-level design.
• Industrial-Grade Operation: −40 °C to 100 °C operating range and industrial grade designation support deployment in temperature-demanding environments.
• Compact Package: 784-FCBGA (23×23) BGA package provides a high-density assembly option for space-constrained PCBs.
• Regulatory Compliance: RoHS compliance supports environmental and assembly process requirements.

Why Choose XCAU20P-1SFVB784I?

The XCAU20P-1SFVB784I positions itself as a high-capacity, industrial-grade FPGA option within the Artix® UltraScale+ family, combining large programmable logic resources, substantial on-chip RAM, and a high I/O count in a compact BGA package. These characteristics make it well suited for designers who need flexible, reprogrammable logic with robust thermal performance and dense board-level integration.

For engineering teams focused on scalable, long-lived designs, this FPGA provides a balance of logic density, embedded memory, and I/O capability that supports consolidation of functions, reduced external component counts, and deployment in environments requiring industrial temperature tolerance.

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