XCAU15P-L1UBVA368I

IC FPGA ARTIXUP LP 368BGA
Part Description

Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC 128 5347738 170100 368-WFBGA, FCBGA

Quantity 397 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package368-FCBGA (10.5x10.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case368-WFBGA, FCBGANumber of I/O128Voltage698 mV - 742 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs9720Number of Logic Elements/Cells170100
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits5347738

Overview of XCAU15P-L1UBVA368I – Artix® UltraScale+ Field Programmable Gate Array, 128 I/O, approximately 170,100 logic elements

The XCAU15P-L1UBVA368I is an Artix® UltraScale+ field programmable gate array (FPGA) IC designed for programmable logic implementations. It combines a high logic element count with multi-megabit on-chip memory, supplied in a compact 368-FCBGA / 368-WFBGA surface-mount package and specified for industrial temperature operation.

This device targets designs that require substantial programmable logic and embedded memory capacity while meeting industrial temperature and RoHS compliance requirements.

Key Features

  • Core Logic Capacity Approximately 170,100 logic elements provide significant programmable logic resources for complex designs.
  • Embedded Memory Approximately 5.35 Mbits of embedded RAM bits support large on-chip buffering, state storage, and data processing.
  • I/O Resources 128 I/O pins deliver flexible interfacing for external peripherals and subsystems.
  • Package and Mounting Available in a 368-FCBGA (10.5 × 10.5 mm) and 368-WFBGA package; surface-mount mounting type for board-level integration.
  • Supply Voltage Voltage supply range of 698 mV to 742 mV as specified for the device.
  • Temperature and Grade Industrial-grade device operation across −40 °C to 100 °C.
  • Environmental Compliance RoHS compliant.

Unique Advantages

  • High logic density: Approximately 170,100 logic elements enable implementation of large-scale programmable functions without immediate need for external logic.
  • Substantial on‑chip memory: Approximately 5.35 Mbits of embedded RAM reduces dependence on external memory for buffering and state machines.
  • Balanced I/O count: 128 I/Os provide straightforward connectivity for a wide range of peripheral devices and interfaces.
  • Industrial temperature operation: Rated −40 °C to 100 °C to support deployments in demanding thermal environments.
  • Compact, surface-mount package: 368-FCBGA (10.5 × 10.5 mm) packaging minimizes board space while supporting high-density routing.
  • Regulatory compliance: RoHS compliance supports environmentally conscious designs and regulatory requirements.

Why Choose XCAU15P-L1UBVA368I?

The XCAU15P-L1UBVA368I positions itself as a high-capacity Artix® UltraScale+ FPGA option that pairs a large number of logic elements with multi-megabit embedded memory in a compact, industrial-temperature-rated package. Its combination of logic density, on-chip RAM, and a 128-pin I/O complement makes it suitable for projects that need substantial programmable resources within constrained board space.

Manufactured by AMD and offered in a 368-FCBGA / 368-WFBGA surface-mount package, this device is appropriate for engineering teams seeking a robust, RoHS-compliant FPGA building block for industrial applications.

Request a quote or submit an inquiry for pricing and availability of the XCAU15P-L1UBVA368I to evaluate it for your next design.

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