XCAU15P-L1FFVB676I

The XCAU15P-L1FFVB676I is an Artix® UltraScale+ Field Programmable Gate Array (FPGA) from AMD designed for industrial-grade applications. This device integrates a large logic fabric and on-chip memory with a high I/O count to support reconfigurable designs where thermal and voltage operating ranges must be defined and met.

Key on-chip resources include 170,100 logic elements and approximately 5.35 Mbits of embedded memory, providing the capacity needed for complex control, signal-processing, and interface functions in industrial systems.

Key Features

• Logic Capacity  170,100 logic elements to implement complex digital logic and custom hardware acceleration.
• Embedded Memory  Approximately 5.35 Mbits of on-chip RAM for buffering, packet storage, and state memory.
• I/O and Interfaces  228 user I/Os to support high-pin-count interfaces and multiple parallel connections.
• Power Supply  Operates from a specified supply range of 698 mV to 742 mV, enabling defined low-voltage system designs.
• Package and Mounting  676-ball FCBGA package (27 × 27) in a 676-BBGA footprint, intended for surface-mount PCB assembly.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Industrial Control  Implement motor control, PLC logic, and modular I/O processing using the device’s logic capacity and industrial temperature rating.
• Embedded Systems  Use the FPGA for custom processing blocks, protocol bridging, and interface aggregation where flexible, reprogrammable logic is required.
• Communications Infrastructure  Leverage the high I/O count and on-chip RAM for data buffering and parallel interface handling in networking equipment.

Unique Advantages

• High Logic Density: 170,100 logic elements provide the capacity to implement substantial custom digital functions without external glue logic.
• Significant On‑Chip Memory: Approximately 5.35 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
• Generous I/O Resources: 228 I/Os enable multiple parallel interfaces and flexible board-level connectivity options.
• Industrial‑Class Operation: Specified −40 °C to 100 °C operating range supports deployments in demanding environmental conditions.
• Compact FCBGA Package: The 676-ball, 27 × 27 FCBGA package offers a dense footprint for high-pin-count applications while remaining surface-mount compatible.
• Defined Low‑Voltage Operation: Narrow supply range (698 mV to 742 mV) supports designs optimized for low-voltage power domains.

Why Choose XCAU15P-L1FFVB676I?

The XCAU15P-L1FFVB676I combines a large logic fabric, substantial embedded memory, and a high number of I/Os in a compact FCBGA package rated for industrial temperatures. It is suited for designers who require reconfigurable hardware capacity and defined electrical and environmental specifications for long-life industrial deployments.

This device is appropriate for development of control, communications, and embedded processing systems where on-chip resources and industrial-grade operation provide design stability, scalability, and simplified BOM choices.

If you would like pricing or lead-time information, request a quote or submit an inquiry for the XCAU15P-L1FFVB676I and our team will respond with the next steps.