XC7VX690T-2FFG1930I
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 1000 54190080 693120 1924-BBGA, FCBGA |
|---|---|
| Quantity | 1,972 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1930-FCBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1924-BBGA, FCBGA | Number of I/O | 1000 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 54150 | Number of Logic Elements/Cells | 693120 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 54190080 |
Overview of XC7VX690T-2FFG1930I – Virtex®-7 XT FPGA, 693,120 Logic Elements, 1,000 I/O
The XC7VX690T-2FFG1930I is a Virtex®-7 XT field programmable gate array (FPGA) provided by AMD. It integrates a very large logic fabric with substantial on‑chip memory and a high I/O count in a ball‑grid array package, supplied as a surface‑mount device and rated for industrial temperature operation.
This device is targeted at designs that require large logic capacity, extensive embedded memory, and high pin count while operating across a wide supply voltage range and industrial temperature window.
Key Features
- Logic Capacity 693,120 logic elements for implementing large, complex programmable logic designs.
- Embedded Memory Approximately 54.19 Mbits of on‑chip RAM to support data buffering, large state machines, and memory‑intensive functions.
- I/O Count 1,000 user I/O pins to support dense interfacing and multiple high‑pin peripheral connections.
- Package and Mounting 1924‑BBGA FCBGA package; supplier device package listed as 1930‑FCBGA (45×45). Surface‑mount mounting type.
- Power Supply Range Core voltage supply range of 0.970 V to 1.03 V to match targeted power domains and system rails.
- Operating Temperature Industrial temperature grade with an operating range of −40 °C to 100 °C for robust operation in demanding environments.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High logic density: 693,120 logic elements enable consolidation of complex functions into a single device, reducing board count and interconnect complexity.
- Substantial on‑chip memory: Approximately 54.19 Mbits of embedded RAM supports large buffering and state storage directly on the FPGA fabric.
- Extensive I/O capability: 1,000 I/Os accommodate multiple parallel interfaces and high‑pin subsystems without external multiplexing.
- Industrial temperature rating: −40 °C to 100 °C operation supports deployment in temperature‑challenging environments.
- Compact FCBGA packaging: 1924‑BBGA / 1930‑FCBGA (45×45) options provide a high‑density footprint for space‑constrained system boards.
- RoHS compliant: Meets regulatory requirements for lead‑free assembly and environmental considerations.
Why Choose XC7VX690T-2FFG1930I?
The XC7VX690T-2FFG1930I combines very large logic capacity, significant embedded memory, and a high I/O count in an industrial‑grade FCBGA package. Its voltage supply window and operating temperature range make it suitable for systems that require a robust, high‑density programmable solution while adhering to environmental compliance.
This part is suitable for designers and procurement teams looking for a single FPGA platform that delivers consolidated logic, memory resources, and extensive connectivity in a surface‑mount, industrial‑rated package from AMD.
Request a quote or submit an inquiry to receive pricing and availability information for the XC7VX690T-2FFG1930I.

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