XC7VX690T-2FFG1930I

IC FPGA 1000 I/O 1930FCBGA
Part Description

Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 1000 54190080 693120 1924-BBGA, FCBGA

Quantity 1,972 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1930-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1924-BBGA, FCBGANumber of I/O1000Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs54150Number of Logic Elements/Cells693120
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits54190080

Overview of XC7VX690T-2FFG1930I – Virtex®-7 XT FPGA, 693,120 Logic Elements, 1,000 I/O

The XC7VX690T-2FFG1930I is a Virtex®-7 XT field programmable gate array (FPGA) provided by AMD. It integrates a very large logic fabric with substantial on‑chip memory and a high I/O count in a ball‑grid array package, supplied as a surface‑mount device and rated for industrial temperature operation.

This device is targeted at designs that require large logic capacity, extensive embedded memory, and high pin count while operating across a wide supply voltage range and industrial temperature window.

Key Features

  • Logic Capacity 693,120 logic elements for implementing large, complex programmable logic designs.
  • Embedded Memory Approximately 54.19 Mbits of on‑chip RAM to support data buffering, large state machines, and memory‑intensive functions.
  • I/O Count 1,000 user I/O pins to support dense interfacing and multiple high‑pin peripheral connections.
  • Package and Mounting 1924‑BBGA FCBGA package; supplier device package listed as 1930‑FCBGA (45×45). Surface‑mount mounting type.
  • Power Supply Range Core voltage supply range of 0.970 V to 1.03 V to match targeted power domains and system rails.
  • Operating Temperature Industrial temperature grade with an operating range of −40 °C to 100 °C for robust operation in demanding environments.
  • Environmental Compliance RoHS compliant.

Unique Advantages

  • High logic density: 693,120 logic elements enable consolidation of complex functions into a single device, reducing board count and interconnect complexity.
  • Substantial on‑chip memory: Approximately 54.19 Mbits of embedded RAM supports large buffering and state storage directly on the FPGA fabric.
  • Extensive I/O capability: 1,000 I/Os accommodate multiple parallel interfaces and high‑pin subsystems without external multiplexing.
  • Industrial temperature rating: −40 °C to 100 °C operation supports deployment in temperature‑challenging environments.
  • Compact FCBGA packaging: 1924‑BBGA / 1930‑FCBGA (45×45) options provide a high‑density footprint for space‑constrained system boards.
  • RoHS compliant: Meets regulatory requirements for lead‑free assembly and environmental considerations.

Why Choose XC7VX690T-2FFG1930I?

The XC7VX690T-2FFG1930I combines very large logic capacity, significant embedded memory, and a high I/O count in an industrial‑grade FCBGA package. Its voltage supply window and operating temperature range make it suitable for systems that require a robust, high‑density programmable solution while adhering to environmental compliance.

This part is suitable for designers and procurement teams looking for a single FPGA platform that delivers consolidated logic, memory resources, and extensive connectivity in a surface‑mount, industrial‑rated package from AMD.

Request a quote or submit an inquiry to receive pricing and availability information for the XC7VX690T-2FFG1930I.

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