XC7VX690T-2FFG1927I
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 600 54190080 693120 1924-BBGA, FCBGA |
|---|---|
| Quantity | 360 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1927-FCBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1924-BBGA, FCBGA | Number of I/O | 600 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 54150 | Number of Logic Elements/Cells | 693120 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 54190080 |
Overview of XC7VX690T-2FFG1927I – Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 600 54190080 693120 1924-BBGA, FCBGA
The XC7VX690T-2FFG1927I is a Virtex®-7 XT field programmable gate array (FPGA) supplied in BGA/FCBGA package options for surface-mount assembly. It delivers very large logic capacity and on-chip memory tailored for demanding industrial applications that require high I/O counts and robust operating conditions.
Key architectural highlights include 693,120 logic elements, approximately 54 Mbits of embedded memory, and 600 available I/O pins, providing a foundation for dense, highly integrated digital designs.
Key Features
- Logic Capacity — 693,120 logic elements and 54,150 configurable logic blocks (CLBs) to implement large, complex digital designs.
- Embedded Memory — Approximately 54 Mbits of on-chip RAM for data buffering, state storage, and memory-intensive functions.
- I/O Density — 600 I/O pins to support high-pin-count connectivity and multiple external interfaces.
- Power Requirements — Core supply range of 970 mV to 1.03 V to match specified system power rails.
- Package & Mounting — Available in 1924-BBGA and FCBGA package styles; supplier device package listed as 1927-FCBGA (45×45); surface-mount mounting type.
- Temperature & Grade — Industrial-grade device rated for operation from −40 °C to 100 °C and RoHS compliant for environmental compatibility.
Typical Applications
- High-density digital processing — Use where large logic capacity and embedded memory are required to implement complex custom processing pipelines.
- High I/O interface systems — Suited to designs that require hundreds of external connections and flexible I/O allocation.
- Industrial control and instrumentation — Applicable to industrial systems that benefit from industrial-grade temperature range and surface-mount packaging.
Unique Advantages
- Extensive logic resources: 693,120 logic elements enable implementation of large-scale digital functions without external logic expansion.
- Substantial on-chip memory: Approximately 54 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
- High I/O count: 600 I/O pins allow integration with numerous peripherals and interfaces while minimizing external multiplexing.
- Industrial operating range: Rated from −40 °C to 100 °C to meet the environmental needs of many industrial deployments.
- Surface-mount BGA/FCBGA packaging: Compact package options (including 1927-FCBGA 45×45) support high-density PCB designs and automated assembly.
- RoHS compliant: Conforms to RoHS requirements for reduced hazardous substances in manufacturing.
Why Choose XC7VX690T-2FFG1927I?
The XC7VX690T-2FFG1927I positions itself as a high-capacity Virtex®-7 XT FPGA suited for designs that demand large logic resources, significant embedded memory, and substantial I/O capability within an industrial temperature range. Its combination of hundreds of I/Os, roughly 693,120 logic elements, and approximately 54 Mbits of on-chip RAM delivers integration and scalability for complex digital architectures.
This device is appropriate for teams and projects that require a durable, high-density FPGA solution with surface-mount BGA/FCBGA packaging and defined core voltage requirements, providing a clear specification basis for system power design and thermal planning.
Request a quote or submit an inquiry to receive pricing, availability, and technical assistance for the XC7VX690T-2FFG1927I.

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