XC7VX690T-2FFG1927C
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 600 54190080 693120 1924-BBGA, FCBGA |
|---|---|
| Quantity | 449 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1927-FCBGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1924-BBGA, FCBGA | Number of I/O | 600 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 54150 | Number of Logic Elements/Cells | 693120 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 54190080 |
Overview of XC7VX690T-2FFG1927C – Virtex®-7 XT FPGA, 693,120 logic elements, 600 I/O
The XC7VX690T-2FFG1927C is a Virtex®-7 XT field programmable gate array (FPGA) IC from AMD. It delivers very high logic density and extensive I/O in a BGA package for commercial embedded and system applications.
With 693,120 logic elements, approximately 54 Mbits of embedded memory, and up to 600 I/O, this device is targeted at designs that require high integration of programmable logic, on-chip memory and broad interface connectivity while operating within a commercial temperature range.
Key Features
- High Logic Density 693,120 logic elements to implement complex digital designs, large state machines and deep parallel processing pipelines.
- Embedded Memory Approximately 54 Mbits of on-chip RAM to support buffering, packet queuing and local storage for compute-intensive tasks.
- Extensive I/O 600 user I/O pins to accommodate multiple high-pin-count interfaces and broad system connectivity.
- Power Supply Range Core voltage supply specified at 970 mV to 1.03 V, enabling defined power planning for the device core.
- Package and Mounting Available in 1924-BBGA (FCBGA) package; supplier device package listed as 1927-FCBGA (45×45). Surface mount mounting type suitable for standard PCB assembly.
- Operating Range and Grade Commercial grade device with operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental conformity.
Typical Applications
- High-density digital signal processing — Use the large logic count and on-chip RAM to implement parallel DSP pipelines and data-path accelerators.
- Multi-interface communications — Leverage 600 I/O pins to integrate multiple protocol interfaces and bridge subsystems within a single FPGA.
- Prototyping and system integration — High logic and memory resources support complex system-level prototypes and integrated subsystems during product development.
Unique Advantages
- Highly integrated programmable fabric: 693,120 logic elements reduce the need for multiple discrete devices and simplify board-level integration.
- Substantial on-chip memory: Approximately 54 Mbits of embedded RAM supports large buffers and local data storage, improving throughput and latency for data-intensive functions.
- Large I/O capacity: 600 I/O pins enable direct connection to many peripherals and interfaces without additional I/O expanders.
- Commercial temperature suitability: Rated for 0 °C to 85 °C operation for standard commercial deployments.
- RoHS compliant: Conforms to RoHS requirements for environmentally conscious design and manufacturing.
- Defined core voltage: Core supply specified between 970 mV and 1.03 V to aid in precise power supply design and thermal planning.
Why Choose XC7VX690T-2FFG1927C?
The XC7VX690T-2FFG1927C positions itself as a high-density Virtex®-7 XT FPGA option for designers needing large programmable logic capacity, significant on-chip memory and plentiful I/O in a surface-mount BGA package. Its specifications support integration of complex digital functions and multi-interface systems within commercial temperature environments.
This device is suitable for development teams and system designers aiming to consolidate functions into a single FPGA, scale logic and memory resources, and maintain clear power and package specifications. Manufactured by AMD and provided in robust BGA package options, it delivers the hardware foundation for demanding embedded and system-level applications.
Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the XC7VX690T-2FFG1927C.

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