XC7VX690T-2FFG1761C

The XC7VX690T-2FFG1761C is a Virtex‑7 XT Field Programmable Gate Array (FPGA) IC featuring a high logic capacity and substantial on‑chip memory in a ball‑grid FCBGA package. It is a surface‑mount, commercial‑grade FPGA designed for designs that require large programmable logic arrays, extensive embedded RAM, and a high I/O count.

With 693,120 logic elements, approximately 54.19 Mbits of embedded memory, and 850 I/O pins, the device targets complex digital implementations where integration density, on‑chip buffering, and connectivity are key considerations.

Key Features

• Core Logic Capacity — 693,120 logic elements to support large-scale programmable logic implementations and complex custom logic designs.
• Embedded Memory — Approximately 54.19 Mbits of on‑chip RAM available for buffering, packet/stream storage, and algorithmic data working sets.
• I/O Density — 850 user I/O pins for broad peripheral connectivity and multi‑lane interfacing across external devices and subsystems.
• Power Supply Range — Operates with a core voltage supply between 970 mV and 1.03 V to match target system power rails and regulator designs.
• Package & Mounting — Supplied in a 1760‑BBGA FCBGA package; supplier device package listed as 1761‑FCBGA (42.5×42.5 mm), designed for surface‑mount PCB assembly.
• Grade & Temperature — Commercial grade device with an operating temperature range of 0 °C to 85 °C for standard environment deployments.
• Compliance — RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High‑density logic designs — For implementations that require a large number of programmable logic cells to consolidate multiple functions into a single FPGA.
• On‑chip buffering and memory‑centric processing — Suitable for designs that leverage substantial embedded RAM for data buffering, streaming, or temporary storage.
• Multi‑interface systems — Useful where a high I/O count is needed to connect numerous peripherals, sensors, or parallel data lanes.

Unique Advantages

• High programmable capacity: 693,120 logic elements allow consolidation of complex logic, reducing external component count and board complexity.
• Significant embedded memory: Approximately 54.19 Mbits of on‑chip RAM supports larger data buffers and reduces external memory bandwidth requirements.
• Extensive I/O availability: 850 I/O pins enable flexible system partitioning and rich peripheral connectivity without additional multiplexing hardware.
• Surface‑mount FCBGA packaging: The 1761‑FCBGA (42.5×42.5 mm) form factor supports modern high‑density PCB assembly and thermal solutions.
• Commercial grade suitability: Rated for 0 °C to 85 °C operation for standard commercial applications and environments.
• RoHS compliant: Aligns with environmental and manufacturing requirements for lead‑free assembly.

Why Choose XC7VX690T-2FFG1761C?

The XC7VX690T-2FFG1761C positions itself as a high‑capacity, memory‑rich Virtex‑7 XT FPGA that balances large programmable logic resources with substantial embedded RAM and abundant I/O. Its FCBGA package and surface‑mount design make it appropriate for compact, high‑density PCBs where integration and connector counts matter.

This device is suited for development teams and product designs that require consolidated logic, on‑chip buffering, and extensive external interfacing within a commercial temperature range, offering a scalable platform for complex digital implementations.

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