XC7VX690T-2FFG1158I
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 350 54190080 693120 1156-BBGA, FCBGA |
|---|---|
| Quantity | 309 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1158-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 350 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 54150 | Number of Logic Elements/Cells | 693120 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 54190080 |
Overview of XC7VX690T-2FFG1158I – Virtex®-7 XT Field Programmable Gate Array (FPGA)
The XC7VX690T-2FFG1158I is a Virtex-7 XT Field Programmable Gate Array (FPGA) in a surface-mount FCBGA package. It combines a large logic fabric with substantial on-chip memory and a high I/O count to address complex programmable logic requirements.
This device provides 693,120 logic elements, approximately 54.19 Mbits of embedded memory, and 350 I/O pins. It operates from a core supply range of 0.97–1.03 V and is specified for industrial temperature operation from −40 °C to 100 °C.
Key Features
- Core and Logic — 693,120 logic elements to implement large-scale programmable logic and complex algorithms.
- Embedded Memory — Approximately 54.19 Mbits of on-chip RAM for buffering, lookup tables, and state storage without immediate dependency on external memory.
- I/O Resources — 350 general-purpose I/O pins to support broad interfacing and system connectivity.
- Power — Core voltage supply specified from 970 mV to 1.03 V for system power planning and thermal considerations.
- Package & Mounting — Surface-mount 1156-BBGA, FCBGA package; supplier device package listed as 1158-FCBGA (35×35) for compact, high-density PCB layouts.
- Temperature Grade — Industrial operating range from −40 °C to 100 °C for deployment in temperature-challenging environments.
- Environmental Compliance — RoHS compliant.
Unique Advantages
- Large logic capacity: 693,120 logic elements enable implementation of extensive custom logic and parallel processing architectures.
- Substantial on-chip memory: Approximately 54.19 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks.
- High connectivity: 350 I/O pins provide flexibility for multi-channel interfaces, high-pin-count peripherals, and diverse system I/O requirements.
- Compact, high-density packaging: FCBGA package (1156-BBGA; supplier 1158-FCBGA 35×35) supports dense PCB designs with surface-mount assembly.
- Industrial temperature capability: Specified operation from −40 °C to 100 °C for deployment in industrial and temperature-variable settings.
- Controlled core voltage: Narrow core supply range (0.97–1.03 V) assists in predictable power budgeting and thermal design.
Why Choose XC7VX690T-2FFG1158I?
The XC7VX690T-2FFG1158I delivers a combination of large logic element count, significant embedded memory, and a high I/O complement in a surface-mount FCBGA package rated for industrial temperatures. It is positioned for designs that require substantial on-chip resources and robust temperature performance.
As a member of the Virtex-7 XT family, this device suits projects needing scalable logic capacity and embedded memory while maintaining compact packaging and industrial-grade operation. Its specification set supports long-term deployments where on-chip capacity and predictable power and thermal characteristics are key considerations.
Request a quote or submit an inquiry to receive pricing and availability information for the XC7VX690T-2FFG1158I.

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