XC7VX690T-2FFG1158I

IC FPGA 350 I/O 1158FCBGA
Part Description

Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 350 54190080 693120 1156-BBGA, FCBGA

Quantity 309 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1158-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1156-BBGA, FCBGANumber of I/O350Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs54150Number of Logic Elements/Cells693120
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits54190080

Overview of XC7VX690T-2FFG1158I – Virtex®-7 XT Field Programmable Gate Array (FPGA)

The XC7VX690T-2FFG1158I is a Virtex-7 XT Field Programmable Gate Array (FPGA) in a surface-mount FCBGA package. It combines a large logic fabric with substantial on-chip memory and a high I/O count to address complex programmable logic requirements.

This device provides 693,120 logic elements, approximately 54.19 Mbits of embedded memory, and 350 I/O pins. It operates from a core supply range of 0.97–1.03 V and is specified for industrial temperature operation from −40 °C to 100 °C.

Key Features

  • Core and Logic — 693,120 logic elements to implement large-scale programmable logic and complex algorithms.
  • Embedded Memory — Approximately 54.19 Mbits of on-chip RAM for buffering, lookup tables, and state storage without immediate dependency on external memory.
  • I/O Resources — 350 general-purpose I/O pins to support broad interfacing and system connectivity.
  • Power — Core voltage supply specified from 970 mV to 1.03 V for system power planning and thermal considerations.
  • Package & Mounting — Surface-mount 1156-BBGA, FCBGA package; supplier device package listed as 1158-FCBGA (35×35) for compact, high-density PCB layouts.
  • Temperature Grade — Industrial operating range from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Environmental Compliance — RoHS compliant.

Unique Advantages

  • Large logic capacity: 693,120 logic elements enable implementation of extensive custom logic and parallel processing architectures.
  • Substantial on-chip memory: Approximately 54.19 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks.
  • High connectivity: 350 I/O pins provide flexibility for multi-channel interfaces, high-pin-count peripherals, and diverse system I/O requirements.
  • Compact, high-density packaging: FCBGA package (1156-BBGA; supplier 1158-FCBGA 35×35) supports dense PCB designs with surface-mount assembly.
  • Industrial temperature capability: Specified operation from −40 °C to 100 °C for deployment in industrial and temperature-variable settings.
  • Controlled core voltage: Narrow core supply range (0.97–1.03 V) assists in predictable power budgeting and thermal design.

Why Choose XC7VX690T-2FFG1158I?

The XC7VX690T-2FFG1158I delivers a combination of large logic element count, significant embedded memory, and a high I/O complement in a surface-mount FCBGA package rated for industrial temperatures. It is positioned for designs that require substantial on-chip resources and robust temperature performance.

As a member of the Virtex-7 XT family, this device suits projects needing scalable logic capacity and embedded memory while maintaining compact packaging and industrial-grade operation. Its specification set supports long-term deployments where on-chip capacity and predictable power and thermal characteristics are key considerations.

Request a quote or submit an inquiry to receive pricing and availability information for the XC7VX690T-2FFG1158I.

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