XC7VX690T-2FF1930I

The XC7VX690T-2FF1930I is a Virtex®-7 XT field programmable gate array (FPGA) IC from AMD, providing very large logic capacity and embedded memory in a high-density FCBGA package. It targets designs that require substantial on-chip resources, a high I/O count, and operation across an industrial temperature range.

Key attributes include approximately 693,120 logic elements, roughly 54.19 Mbits of embedded memory, up to 1,000 I/O pins, and a specified core supply range of 970 mV to 1.03 V—all in a surface-mount 1930-FCBGA (45×45) package.

Key Features

• Core Capacity  Approximately 693,120 logic elements provide a very large programmable fabric for complex digital logic and system-on-chip implementations.
• Embedded Memory  Approximately 54.19 Mbits of on-chip RAM to support buffering, caching, and state storage without external memory in many use cases.
• High I/O Density  Up to 1,000 I/O pins enable wide parallel interfaces and extensive peripheral connectivity on a single device.
• Power and Supply  Core supply specified at 970 mV to 1.03 V, allowing precise power budgeting for high-performance designs.
• Package and Mounting  1930-FCBGA (45×45) package case (1924-BBGA, FCBGA) in a surface-mount form factor for board-level integration.
• Operating Range  Rated for industrial temperatures from −40 °C to 100 °C, supporting deployment in environments with wide thermal variation.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High-density digital designs  Use the large logic capacity for complex control logic, custom processing engines, and system integration where extensive programmable resources are required.
• Memory-intensive processing  Leverage approximately 54.19 Mbits of embedded RAM for buffering, packet processing, and intermediate data storage without immediate dependence on external memory.
• I/O-heavy systems  Deploy in applications needing many parallel interfaces or extensive peripheral connectivity, taking advantage of up to 1,000 I/O pins.
• Industrial electronics  The −40 °C to 100 °C operating range and surface-mount FCBGA package suit industrial-grade electronic systems requiring robust temperature performance.

Unique Advantages

• Very high logic density: Enables implementation of large, complex designs on a single device, reducing the need for multiple FPGAs or external glue logic.
• Substantial on-chip memory: Approximately 54.19 Mbits of embedded RAM reduces external memory requirements and simplifies board-level design.
• Extensive I/O capability: Up to 1,000 I/Os support broad peripheral integration and high-throughput interfacing.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in demanding thermal environments.
• Compact surface-mount package: 1930-FCBGA (45×45) package provides a high-density footprint suitable for modern PCBs and automated assembly.
• RoHS compliant: Meets environmental compliance requirements for lead-free assemblies.

Why Choose XC7VX690T-2FF1930I?

The XC7VX690T-2FF1930I positions itself as a high-capacity, industrial-grade FPGA option for designs that demand large programmable logic, significant embedded memory, and a high number of I/Os. Its specified voltage range, package type, and temperature rating make it a clear choice where integration density and robust thermal performance are required.

Choose this FPGA when your project requires scalability of logic and memory resources on a single device, consolidated I/O connectivity, and a surface-mount package suitable for industrial applications—providing a compact, capable building block for complex digital systems.

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