XC7VX690T-2FF1158I

IC FPGA 350 I/O 1158FCBGA
Part Description

Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 350 54190080 693120 1156-BBGA, FCBGA

Quantity 730 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1158-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1156-BBGA, FCBGANumber of I/O350Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs54150Number of Logic Elements/Cells693120
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits54190080

Overview of XC7VX690T-2FF1158I – Virtex®-7 XT FPGA, 1156-BBGA FCBGA

The XC7VX690T-2FF1158I is a Virtex®-7 XT field programmable gate array (FPGA) in a high-density FCBGA package. It delivers substantial on-chip resources—approximately 693,120 logic elements and about 54 Mbits of embedded memory—along with 350 user I/Os for complex, high-capacity programmable logic designs.

Designed for industrial-grade applications, this surface-mount FPGA supports a core supply range of 970 mV to 1.03 V and operates across a –40 °C to 100 °C temperature range, enabling reliable performance in demanding environments.

Key Features

  • Core Logic Density  Approximately 693,120 logic elements to implement large-scale custom logic and deep pipelined architectures.
  • Embedded Memory  Approximately 54 Mbits of on-chip RAM for buffering, state storage, and high-throughput data paths.
  • I/O Capability  350 user I/Os to support wide interfacing options and high-bandwidth connectivity within system designs.
  • Package & Mounting  1156-BBGA, FCBGA package; supplier device package listed as 1158-FCBGA (35×35). Surface-mount mounting for standard PCB assembly processes.
  • Power  Core voltage supply range from 970 mV to 1.03 V to match system power-rail requirements.
  • Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
  • Compliance  RoHS compliant, supporting lead-free and environmentally conscious manufacturing.

Typical Applications

  • High-performance compute acceleration  Use the device's large logic capacity and embedded memory to implement custom accelerators and hardware pipelines.
  • Data center and networking  350 I/Os and substantial on-chip RAM enable packet processing, protocol offload, and programmable switch/bridge functions.
  • Signal processing and DSP  High logic density and embedded memory support complex filtering, FFTs, and real-time processing pipelines.
  • Industrial control and automation  Industrial temperature rating and flexible I/O count make the FPGA suitable for motor control, motion systems, and machine automation tasks.

Unique Advantages

  • High integration density: Consolidate functions on-chip with approximately 693,120 logic elements and ~54 Mbits of RAM, reducing external component count and PCB area.
  • Flexible I/O capacity: 350 user I/Os allow broad system interfacing and support for parallel data lanes or multiple peripheral connections.
  • Industrial-grade reliability: Specified operation from –40 °C to 100 °C for dependable performance in challenging environments.
  • Compact FCBGA packaging: 1156-BBGA / 1158-FCBGA (35×35) packages provide a dense form factor for space-constrained designs.
  • Controlled core power range: Core supply specified between 970 mV and 1.03 V for predictable power budgeting and system integration.
  • RoHS compliant: Supports environmentally conscious manufacturing and end-product requirements.

Why Choose XC7VX690T-2FF1158I?

The XC7VX690T-2FF1158I positions itself as a high-density, industrial-grade FPGA suited for engineers who need substantial programmable resources, high I/O counts, and dependable operation across a wide temperature range. Its combination of roughly 693,120 logic elements, approximately 54 Mbits of embedded memory, and 350 I/Os provides the on-chip capacity required for complex data processing, acceleration, and control tasks.

This device is appropriate for designs that demand scalability and integration in a compact FCBGA package while adhering to industrial environmental requirements. Its clear electrical and mechanical specifications simplify system-level planning and BOM decisions for production deployments.

Request a quote today to check availability and receive pricing and lead-time information for the XC7VX690T-2FF1158I.

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