XC7VX690T-2FF1158I
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 350 54190080 693120 1156-BBGA, FCBGA |
|---|---|
| Quantity | 730 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1158-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 350 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 54150 | Number of Logic Elements/Cells | 693120 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 54190080 |
Overview of XC7VX690T-2FF1158I – Virtex®-7 XT FPGA, 1156-BBGA FCBGA
The XC7VX690T-2FF1158I is a Virtex®-7 XT field programmable gate array (FPGA) in a high-density FCBGA package. It delivers substantial on-chip resources—approximately 693,120 logic elements and about 54 Mbits of embedded memory—along with 350 user I/Os for complex, high-capacity programmable logic designs.
Designed for industrial-grade applications, this surface-mount FPGA supports a core supply range of 970 mV to 1.03 V and operates across a –40 °C to 100 °C temperature range, enabling reliable performance in demanding environments.
Key Features
- Core Logic Density Approximately 693,120 logic elements to implement large-scale custom logic and deep pipelined architectures.
- Embedded Memory Approximately 54 Mbits of on-chip RAM for buffering, state storage, and high-throughput data paths.
- I/O Capability 350 user I/Os to support wide interfacing options and high-bandwidth connectivity within system designs.
- Package & Mounting 1156-BBGA, FCBGA package; supplier device package listed as 1158-FCBGA (35×35). Surface-mount mounting for standard PCB assembly processes.
- Power Core voltage supply range from 970 mV to 1.03 V to match system power-rail requirements.
- Industrial Temperature Grade Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
- Compliance RoHS compliant, supporting lead-free and environmentally conscious manufacturing.
Typical Applications
- High-performance compute acceleration Use the device's large logic capacity and embedded memory to implement custom accelerators and hardware pipelines.
- Data center and networking 350 I/Os and substantial on-chip RAM enable packet processing, protocol offload, and programmable switch/bridge functions.
- Signal processing and DSP High logic density and embedded memory support complex filtering, FFTs, and real-time processing pipelines.
- Industrial control and automation Industrial temperature rating and flexible I/O count make the FPGA suitable for motor control, motion systems, and machine automation tasks.
Unique Advantages
- High integration density: Consolidate functions on-chip with approximately 693,120 logic elements and ~54 Mbits of RAM, reducing external component count and PCB area.
- Flexible I/O capacity: 350 user I/Os allow broad system interfacing and support for parallel data lanes or multiple peripheral connections.
- Industrial-grade reliability: Specified operation from –40 °C to 100 °C for dependable performance in challenging environments.
- Compact FCBGA packaging: 1156-BBGA / 1158-FCBGA (35×35) packages provide a dense form factor for space-constrained designs.
- Controlled core power range: Core supply specified between 970 mV and 1.03 V for predictable power budgeting and system integration.
- RoHS compliant: Supports environmentally conscious manufacturing and end-product requirements.
Why Choose XC7VX690T-2FF1158I?
The XC7VX690T-2FF1158I positions itself as a high-density, industrial-grade FPGA suited for engineers who need substantial programmable resources, high I/O counts, and dependable operation across a wide temperature range. Its combination of roughly 693,120 logic elements, approximately 54 Mbits of embedded memory, and 350 I/Os provides the on-chip capacity required for complex data processing, acceleration, and control tasks.
This device is appropriate for designs that demand scalability and integration in a compact FCBGA package while adhering to industrial environmental requirements. Its clear electrical and mechanical specifications simplify system-level planning and BOM decisions for production deployments.
Request a quote today to check availability and receive pricing and lead-time information for the XC7VX690T-2FF1158I.

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