XC7VX690T-2FF1926I
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 720 54190080 693120 1924-BBGA, FCBGA |
|---|---|
| Quantity | 673 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1926-FCBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1924-BBGA, FCBGA | Number of I/O | 720 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 54150 | Number of Logic Elements/Cells | 693120 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 54190080 |
Overview of XC7VX690T-2FF1926I – Virtex®-7 XT FPGA, 720 I/O, 1924-BBGA
The XC7VX690T-2FF1926I is a Virtex®-7 XT Field Programmable Gate Array (FPGA) IC designed for high-density, I/O-rich system designs. Architected with 54,150 CLBs and 693,120 logic elements, it delivers substantial programmable logic capacity alongside approximately 54 Mbits of embedded memory and up to 720 I/O pins.
Targeted at applications that require large on-chip logic and memory resources within an industrial temperature range, this device combines high integration with a compact FCBGA package and a low-voltage core supply range for power-sensitive designs.
Key Features
- Core Logic 54,150 CLBs providing a total of 693,120 logic elements for large-scale programmable logic implementations.
- Embedded Memory Approximately 54 Mbits of on-chip RAM to support buffering, state machines, and data storage directly on the FPGA fabric.
- I/O Capacity Up to 720 I/O pins to accommodate complex peripheral and board-level interfacing requirements.
- Power Core voltage supply range from 970 mV to 1.03 V to match low-voltage system architectures and help manage power delivery.
- Package & Mounting 1924-BBGA (FCBGA) package case with supplier device package reference 1926-FCBGA (45×45), designed for surface-mount assembly.
- Temperature Range Industrial-grade operating range from −40 °C to 100 °C for deployment in temperature-challenged environments.
- Regulatory RoHS-compliant construction for adherence to common material restrictions.
Typical Applications
- High-density logic designs — Systems that require hundreds of thousands of logic elements and extensive CLB resources for complex custom logic implementations.
- I/O-intensive systems — Designs that need a large number of external interfaces, leveraging the device's 720 available I/O pins.
- Memory-heavy functions — Applications that benefit from substantial on-chip RAM capacity for buffering, data handling, and local storage without external memory.
- Industrial temperature deployments — Equipment and systems that operate across −40 °C to 100 °C and require industrial-grade components.
Unique Advantages
- High logical density: 693,120 logic elements enable implementation of large and complex designs on a single device, reducing the need for multiple FPGAs.
- Substantial embedded memory: Approximately 54 Mbits of on-chip RAM supports data buffering and stateful processing close to the logic fabric.
- Extensive I/O: Up to 720 I/O pins simplify board-level routing for systems with numerous external interfaces and peripherals.
- Industrial temperature capability: Rated for −40 °C to 100 °C operation, suitable for deployments that require extended temperature range reliability.
- Compact FCBGA packaging: 1924-BBGA/1926-FCBGA (45×45) format offers a high-pin-count solution in a surface-mount package for dense board layouts.
- Low-voltage core operation: Core supply between 970 mV and 1.03 V aligns with low-voltage power architectures to help manage overall system power.
Why Choose XC7VX690T-2FF1926I?
The XC7VX690T-2FF1926I positions itself as a high-capacity, industrial-grade FPGA that combines extensive programmable logic, significant embedded memory, and a large I/O complement in an FCBGA surface-mount package. It is well suited for engineers and procurement teams seeking a single-device solution to consolidate complex logic, memory buffering, and numerous interfaces while operating across an industrial temperature range.
With RoHS compliance, a defined low-voltage core supply range, and a supplier package reference for board integration, this Virtex‑7 XT device offers a practical balance of integration and specification clarity for long-term designs that demand predictable hardware characteristics.
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