XC7VX690T-2FF1926I

IC FPGA 720 I/O 1926FCBGA
Part Description

Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 720 54190080 693120 1924-BBGA, FCBGA

Quantity 673 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1926-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1924-BBGA, FCBGANumber of I/O720Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs54150Number of Logic Elements/Cells693120
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits54190080

Overview of XC7VX690T-2FF1926I – Virtex®-7 XT FPGA, 720 I/O, 1924-BBGA

The XC7VX690T-2FF1926I is a Virtex®-7 XT Field Programmable Gate Array (FPGA) IC designed for high-density, I/O-rich system designs. Architected with 54,150 CLBs and 693,120 logic elements, it delivers substantial programmable logic capacity alongside approximately 54 Mbits of embedded memory and up to 720 I/O pins.

Targeted at applications that require large on-chip logic and memory resources within an industrial temperature range, this device combines high integration with a compact FCBGA package and a low-voltage core supply range for power-sensitive designs.

Key Features

  • Core Logic 54,150 CLBs providing a total of 693,120 logic elements for large-scale programmable logic implementations.
  • Embedded Memory Approximately 54 Mbits of on-chip RAM to support buffering, state machines, and data storage directly on the FPGA fabric.
  • I/O Capacity Up to 720 I/O pins to accommodate complex peripheral and board-level interfacing requirements.
  • Power Core voltage supply range from 970 mV to 1.03 V to match low-voltage system architectures and help manage power delivery.
  • Package & Mounting 1924-BBGA (FCBGA) package case with supplier device package reference 1926-FCBGA (45×45), designed for surface-mount assembly.
  • Temperature Range Industrial-grade operating range from −40 °C to 100 °C for deployment in temperature-challenged environments.
  • Regulatory RoHS-compliant construction for adherence to common material restrictions.

Typical Applications

  • High-density logic designs — Systems that require hundreds of thousands of logic elements and extensive CLB resources for complex custom logic implementations.
  • I/O-intensive systems — Designs that need a large number of external interfaces, leveraging the device's 720 available I/O pins.
  • Memory-heavy functions — Applications that benefit from substantial on-chip RAM capacity for buffering, data handling, and local storage without external memory.
  • Industrial temperature deployments — Equipment and systems that operate across −40 °C to 100 °C and require industrial-grade components.

Unique Advantages

  • High logical density: 693,120 logic elements enable implementation of large and complex designs on a single device, reducing the need for multiple FPGAs.
  • Substantial embedded memory: Approximately 54 Mbits of on-chip RAM supports data buffering and stateful processing close to the logic fabric.
  • Extensive I/O: Up to 720 I/O pins simplify board-level routing for systems with numerous external interfaces and peripherals.
  • Industrial temperature capability: Rated for −40 °C to 100 °C operation, suitable for deployments that require extended temperature range reliability.
  • Compact FCBGA packaging: 1924-BBGA/1926-FCBGA (45×45) format offers a high-pin-count solution in a surface-mount package for dense board layouts.
  • Low-voltage core operation: Core supply between 970 mV and 1.03 V aligns with low-voltage power architectures to help manage overall system power.

Why Choose XC7VX690T-2FF1926I?

The XC7VX690T-2FF1926I positions itself as a high-capacity, industrial-grade FPGA that combines extensive programmable logic, significant embedded memory, and a large I/O complement in an FCBGA surface-mount package. It is well suited for engineers and procurement teams seeking a single-device solution to consolidate complex logic, memory buffering, and numerous interfaces while operating across an industrial temperature range.

With RoHS compliance, a defined low-voltage core supply range, and a supplier package reference for board integration, this Virtex‑7 XT device offers a practical balance of integration and specification clarity for long-term designs that demand predictable hardware characteristics.

Request a quote or submit an inquiry to get pricing and availability information for the XC7VX690T-2FF1926I.

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