XC7VX690T-2FF1761I

The XC7VX690T-2FF1761I is a Virtex®-7 XT Field Programmable Gate Array from AMD designed for high-capacity programmable logic implementations. The device combines a large logic fabric with significant on-chip memory and a high I/O count, packaged in a surface-mount FCBGA format for systems requiring dense integration.

With 693,120 logic elements and approximately 54 Mbits of embedded memory, this industrial-grade FPGA targets complex digital designs that demand high logic density, extensive connectivity, and operation across a wide temperature range.

Key Features

• Logic Capacity  693,120 logic elements provide substantial programmable fabric for complex logic, datapaths, and custom accelerators.
• Embedded Memory  Approximately 54 Mbits of on-chip RAM supports buffering, large lookup tables, and dataflow storage for compute-intensive tasks.
• I/O Density  850 I/O pins enable broad external connectivity for high-bandwidth interfaces and numerous peripheral connections.
• Power Supply  Core supply range of 0.970 V to 1.03 V supports defined power sequencing and system design around the device's core voltage requirements.
• Package and Mounting  Surface-mount FCBGA package (1760-BBGA / supplier package 1761-FCBGA, 42.5 × 42.5 mm) enables compact board-level integration and thermal planning.
• Temperature and Grade  Rated for industrial operation from −40 °C to 100 °C for deployment in demanding environmental conditions.
• Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-performance compute acceleration  Large logic capacity and abundant on-chip RAM make the device suitable for custom accelerators and FPGA-based compute engines.
• Communications and networking  High I/O count and programmable fabric support packet processing, protocol offload, and interface bridging in networking equipment.
• Industrial control and automation  Industrial temperature rating and extensive I/O enable real-time control, signal processing, and system integration in factory and process automation.
• Imaging and signal processing  Significant embedded memory and logic resources facilitate image pipeline processing, filtering, and multi-channel signal conditioning.

Unique Advantages

• High integration density: 693,120 logic elements reduce the need for multiple devices by consolidating complex logic into a single FPGA.
• Substantial on-chip memory: Approximately 54 Mbits of embedded RAM supports data buffering and large working sets without external memory dependence.
• Extensive connectivity: 850 I/O pins provide flexibility for multi-channel interfaces and high-bandwidth external connections.
• Industrial temperature range: Rated −40 °C to 100 °C for reliable operation in temperature-critical environments.
• Compact FCBGA packaging: Surface-mount 1760/1761 FCBGA format (42.5 × 42.5 mm supplier footprint) enables dense board layouts and system-level integration.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and supply chain requirements.

Why Choose XC7VX690T-2FF1761I?

The XC7VX690T-2FF1761I positions itself as a high-capacity, industrial-grade FPGA option for designs that require substantial programmable logic, on-chip memory, and broad I/O. Its combination of logic density and embedded RAM allows engineers to implement sizable custom datapaths and complex control logic within a single device footprint.

Engineered for integration into demanding systems, this device is suited to customers building advanced communications, compute acceleration, imaging, and industrial control solutions who need predictable operating characteristics, a compact FCBGA package, and compliance with RoHS manufacturing standards.

Request a quote today to receive pricing and availability information for the XC7VX690T-2FF1761I and to discuss how this FPGA can meet your project requirements.