XC7VX690T-2FF1157I
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 600 54190080 693120 1156-BBGA, FCBGA |
|---|---|
| Quantity | 645 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1157-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 600 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 54150 | Number of Logic Elements/Cells | 693120 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 54190080 |
Overview of XC7VX690T-2FF1157I – Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 600 54190080 693120 1156-BBGA, FCBGA
The XC7VX690T-2FF1157I is a Virtex®-7 XT Field Programmable Gate Array (FPGA) from AMD, provided in an FCBGA/BBGA package. It delivers a large programmable logic capacity together with substantial on-chip memory and a high I/O count, making it suited for complex, high-density digital designs.
Designed for industrial-grade use, the device offers a wide operating temperature range and a tight core voltage window, supporting deployment in applications that require robust thermal and electrical tolerances.
Key Features
- Logic Capacity Approximately 693,120 logic elements for implementing large, complex digital designs and high-density custom logic.
- On-Chip Memory Approximately 54.2 Mbits of embedded RAM to support buffering, packet processing, and large local data structures.
- I/O Density 600 user I/O pins to support multi-channel interfaces, parallel buses, and high-pin-count connectivity requirements.
- Package Options Supplied in FCBGA/BBGA packaging (Package Case: 1156-BBGA, FCBGA; Supplier Device Package: 1157-FCBGA (35×35)) for board-level integration where high pin-count BGA solutions are required.
- Power and Voltage Core supply range of 970 mV to 1.03 V for precise power budgeting and compatibility with tightly regulated power domains.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C and specified as Industrial grade for deployment in demanding environments.
- Regulatory Compliance RoHS compliant to support environmentally conscious product designs.
Typical Applications
- High-density digital processing Implement complex logic algorithms and large finite-state machines using the device's ~693K logic elements and abundant on-chip memory.
- Multi-channel I/O systems Drive and aggregate numerous parallel or serial channels with the device's 600 I/O pins for protocol bridging and interface consolidation.
- Industrial control and automation Use in industrial equipment and control systems that benefit from the Industrial grade rating and −40 °C to 100 °C operating range.
- Data buffering and packet processing Leverage approximately 54.2 Mbits of embedded RAM for on-chip buffering, packet queues, and local data storage.
Unique Advantages
- High programmable logic density: Approximately 693,120 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
- Significant on-chip memory: Roughly 54.2 Mbits of embedded RAM supports large data structures and buffering without immediate need for external memory.
- Extensive I/O capability: 600 I/O pins provide flexibility to support many interfaces and parallel channel designs from a single FPGA.
- Industrial temperature support: −40 °C to 100 °C operation and Industrial grade designation make the device appropriate for environments with wide temperature swings.
- Compact BGA packaging: FCBGA/BBGA packages (35×35 supplier package option) offer a high pin-count solution in a compact footprint for dense board layouts.
- RoHS compliant: Environmentally compliant build supports regulatory and sustainability goals.
Why Choose XC7VX690T-2FF1157I?
The XC7VX690T-2FF1157I positions itself as a high-capacity Virtex®-7 XT FPGA option for engineers who need significant logic resources, substantial embedded memory, and a large number of I/O pins in an industrial-rated package. Its tight core voltage range and broad operating temperature make it suitable for demanding applications where electrical and thermal margins must be well managed.
Choose this device when your design requires consolidation of multiple high-density functions, large on-chip buffers, and extensive interfacing while maintaining a compact BGA footprint and RoHS compliance.
Request a quote or submit an inquiry to obtain pricing and availability for the XC7VX690T-2FF1157I and to discuss how its specifications map to your project requirements.

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