XC7VX690T-1FFG1927C

The XC7VX690T-1FFG1927C is a Virtex-7 XT Field Programmable Gate Array (FPGA) IC from AMD, offered in a high-pin-count FCBGA package. It provides a large logic capacity and substantial on-chip memory for designs that require high-density programmable logic and extensive I/O connectivity.

With approximately 693,120 logic elements, approximately 54.19 Mbits of embedded memory, and 600 I/O pins, this device is suited to applications that need dense logic integration, significant embedded RAM, and broad external interfacing while operating within a commercial temperature range.

Key Features

• Logic Capacity  Approximately 693,120 logic elements to implement complex programmable logic and wide datapaths.
• Embedded Memory  Approximately 54.19 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive logic functions.
• I/O Density  600 I/O pins to support extensive external interfacing and multi-channel connectivity.
• Core Supply Voltage  Core supply range of 970 mV to 1.03 V to match platform power requirements.
• Package and Mounting  1924-BBGA FCBGA package (supplier device package: 1927-FCBGA, 45×45) with surface-mount assembly.
• Operating Conditions  Commercial grade device rated for 0°C to 85°C operating temperature.
• Standards Compliance  RoHS compliant for regulatory compatibility with lead-free manufacturing processes.

Typical Applications

• High-density digital processing  Implement large-scale custom logic and wide datapaths using the device’s approximately 693,120 logic elements and abundant embedded memory.
• I/O-intensive systems  Support many external interfaces and parallel channels with 600 available I/O pins for broad connectivity.
• Memory-heavy logic  Use the approximately 54.19 Mbits of on-chip RAM for buffering, packet processing, and staged datapaths requiring local storage.
• Board-level integration  Surface-mount FCBGA packaging and a 45×45 supplier package option enable compact, high-density board designs.

Unique Advantages

• Large programmable fabric: Approximately 693,120 logic elements provide the capacity to integrate substantial logic blocks and reduce the need for multiple devices.
• Significant embedded memory: Approximately 54.19 Mbits of on-chip RAM supports memory-intensive functions without relying solely on external memory.
• High I/O count: 600 I/O pins facilitate complex multi-channel interfaces and parallel connectivity requirements.
• Compact package options: 1924-BBGA FCBGA and supplier 1927-FCBGA (45×45) packages enable high-density board implementations with surface-mount assembly.
• Commercial-grade operation: Rated for 0°C to 85°C, suitable for designs targeting standard commercial environments.
• RoHS compliance: Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.

Why Choose XC7VX690T-1FFG1927C?

The XC7VX690T-1FFG1927C delivers high-capacity programmable logic, substantial embedded memory, and extensive I/O in an FCBGA surface-mount package, positioning it for demanding board-level designs that require dense integration and broad interfacing. Its commercial temperature rating and RoHS compliance make it suitable for standard production environments.

This device is appropriate for engineers and teams building complex, memory- and I/O-intensive programmable systems that benefit from a single, high-density FPGA solution to consolidate functions and simplify board-level design.

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