XC7VX690T-1FFG1157I
| Part Description |
Virtex-7 FPGA, XC7VX690T, 693,120 Logic Cells, 3600 DSP, FFG1157, Commercial |
|---|---|
| Quantity | 1,109 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | FFG1157 | Grade | N/A | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1157-BGA | Number of I/O | 1000 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 | Number of LABs/CLBs | 433200 | Number of Logic Elements/Cells | 693120 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.31.00.60 | ||
| Qualification | N/A | Total RAM Bits | 54190080 |
Overview of XC7VX690T-1FFG1157I – Virtex®-7 XT Field Programmable Gate Array (FPGA)
The XC7VX690T-1FFG1157I is a Virtex®-7 XT field programmable gate array in an FCBGA package designed for applications that demand high logic density and substantial embedded memory. It offers a combination of large programmable logic resources, extensive I/O, and an industrial operating temperature range to support robust system designs.
Key Features
- Core Logic — Provides 693,120 logic elements to implement complex digital functions and large-scale programmable designs.
- Embedded Memory — Includes approximately 54.2 Mbits of on-chip RAM for buffering, packet storage, and intermediate data processing.
- I/O Capacity — Up to 600 I/O pins to support wide parallel interfaces, high-channel counts, and diverse peripheral connectivity.
- Power — Core supply range specified at 970 mV to 1.03 V to match system power delivery requirements.
- Package & Mounting — Surface-mount FCBGA packaging with package case listed as 1156-BBGA (supplier device package: 1157-FCBGA, 35×35) for compact board-level integration.
- Temperature & Grade — Industrial grade device rated for operation from −40 °C to 100 °C, suitable for demanding environments.
- Environmental Compliance — RoHS compliant for regulatory and manufacturing compatibility.
Typical Applications
- High-density digital signal processing — Large logic capacity and significant on-chip memory enable complex DSP algorithms and data-path implementations.
- High-performance embedded systems — Combines logic, memory, and I/O to implement custom processors, accelerators, and system controllers.
- Multi-channel interface aggregation — Extensive I/O count supports aggregation and protocol bridging for communication and data-acquisition systems.
- Industrial control and automation — Industrial temperature rating and robust packaging support deployment in factory and process-control environments.
Unique Advantages
- High logic capacity: 693,120 logic elements provide the headroom for complex, large-scale designs without partitioning across multiple devices.
- Substantial embedded memory: Approximately 54.2 Mbits of on-chip RAM reduces external memory dependence and streamlines data buffering.
- Extensive I/O: 600 I/Os allow flexible connectivity to peripherals, sensors, and high-channel-count systems.
- Industrial robustness: Rated for −40 °C to 100 °C operation to meet the needs of temperature-challenging deployments.
- Compact FCBGA packaging: Surface-mount FCBGA (1156-BBGA / supplier 1157-FCBGA 35×35) supports dense PCB integration and reliable board assembly.
- Regulatory readiness: RoHS compliance simplifies materials selection and manufacturing workflows.
Why Choose XC7VX690T-1FFG1157I?
The XC7VX690T-1FFG1157I positions itself as a high-capacity programmable building block for designs that require significant logic resources, ample embedded RAM, and broad I/O flexibility. Its industrial temperature rating and FCBGA packaging make it suitable for systems that must combine performance with environmental resilience.
Engineers and procurement teams seeking a scalable FPGA platform will find this device relevant for advanced digital processing, interface consolidation, and embedded system acceleration where on-chip resources and robust operation are priorities.
Request a quote or submit an inquiry to obtain pricing, availability, and technical support for the XC7VX690T-1FFG1157I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








