XC7VX550T-2FFG1927I

IC FPGA 600 I/O 1927FCBGA
Part Description

Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 600 43499520 554240 1924-BBGA, FCBGA

Quantity 204 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1927-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1924-BBGA, FCBGANumber of I/O600Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs43300Number of Logic Elements/Cells554240
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits43499520

Overview of XC7VX550T-2FFG1927I – Virtex®-7 XT Field Programmable Gate Array (FPGA), 600 I/O, ~43.5 Mbits RAM, 554,240 logic elements, 1924-BBGA (FCBGA)

The XC7VX550T-2FFG1927I is a Virtex®-7 XT field programmable gate array (FPGA) IC manufactured by AMD, designed for designs that require substantial logic capacity, on‑chip memory and a high I/O count. It combines a large programmable fabric with significant embedded RAM and an industrial temperature grade for deployment in equipment operating between -40 °C and 100 °C.

Key Features

  • Logic Capacity  554,240 logic elements provide a large programmable fabric for complex digital designs.
  • Embedded Memory  Approximately 43.5 Mbits of on‑chip RAM (43,499,520 bits total) to support large buffering, buffering and data storage needs within the FPGA.
  • I/O Count  600 user I/O pins to enable broad interfacing with external devices and subsystems.
  • Power Supply  Core voltage range specified from 970 mV to 1.03 V for the device core supply.
  • Package & Mounting  1924‑BBGA FCBGA package case with supplier device package listed as 1927‑FCBGA (45×45); device is intended for surface‑mount PCB assembly.
  • Operating Temperature  Industrial operating range from -40 °C to 100 °C for use in temperature‑demanding environments.
  • Environmental Compliance  RoHS compliant to support lead‑free assembly and regulatory requirements.

Unique Advantages

  • Large programmable fabric: 554,240 logic elements enable integration of complex logic functions that reduce external component count.
  • Substantial on‑chip memory: Approximately 43.5 Mbits of embedded RAM support data buffering and on‑chip storage to streamline system architecture.
  • High I/O density: 600 I/Os allow extensive peripheral and subsystem connectivity without additional I/O expanders.
  • Industrial temperature support: Rated for -40 °C to 100 °C operation for deployment in thermally challenging environments.
  • Compact surface‑mount package: FCBGA package options provide a high‑density board footprint for space‑constrained designs.
  • Regulatory readiness: RoHS compliance supports lead‑free manufacturing processes.

Why Choose XC7VX550T-2FFG1927I?

The XC7VX550T-2FFG1927I positions itself as a high‑capacity Virtex®‑7 XT FPGA option for designs that need extensive logic resources, significant embedded RAM, and a large number of I/O in a surface‑mount FCBGA package. Its industrial temperature rating and defined core voltage range make it suitable for systems that require stable operation across a wide thermal range.

With manufacturing by AMD and clear, verifiable specifications for logic capacity, memory, I/O, package, and environmental compliance, this device is aimed at customers who require substantial on‑chip integration and predictable electrical and thermal characteristics.

Request a quote or submit an inquiry to evaluate the XC7VX550T-2FFG1927I for your next design and receive pricing and availability details tailored to your requirements.

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