XC7VX550T-2FFG1927I
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 600 43499520 554240 1924-BBGA, FCBGA |
|---|---|
| Quantity | 204 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1927-FCBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1924-BBGA, FCBGA | Number of I/O | 600 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 43300 | Number of Logic Elements/Cells | 554240 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 43499520 |
Overview of XC7VX550T-2FFG1927I – Virtex®-7 XT Field Programmable Gate Array (FPGA), 600 I/O, ~43.5 Mbits RAM, 554,240 logic elements, 1924-BBGA (FCBGA)
The XC7VX550T-2FFG1927I is a Virtex®-7 XT field programmable gate array (FPGA) IC manufactured by AMD, designed for designs that require substantial logic capacity, on‑chip memory and a high I/O count. It combines a large programmable fabric with significant embedded RAM and an industrial temperature grade for deployment in equipment operating between -40 °C and 100 °C.
Key Features
- Logic Capacity 554,240 logic elements provide a large programmable fabric for complex digital designs.
- Embedded Memory Approximately 43.5 Mbits of on‑chip RAM (43,499,520 bits total) to support large buffering, buffering and data storage needs within the FPGA.
- I/O Count 600 user I/O pins to enable broad interfacing with external devices and subsystems.
- Power Supply Core voltage range specified from 970 mV to 1.03 V for the device core supply.
- Package & Mounting 1924‑BBGA FCBGA package case with supplier device package listed as 1927‑FCBGA (45×45); device is intended for surface‑mount PCB assembly.
- Operating Temperature Industrial operating range from -40 °C to 100 °C for use in temperature‑demanding environments.
- Environmental Compliance RoHS compliant to support lead‑free assembly and regulatory requirements.
Unique Advantages
- Large programmable fabric: 554,240 logic elements enable integration of complex logic functions that reduce external component count.
- Substantial on‑chip memory: Approximately 43.5 Mbits of embedded RAM support data buffering and on‑chip storage to streamline system architecture.
- High I/O density: 600 I/Os allow extensive peripheral and subsystem connectivity without additional I/O expanders.
- Industrial temperature support: Rated for -40 °C to 100 °C operation for deployment in thermally challenging environments.
- Compact surface‑mount package: FCBGA package options provide a high‑density board footprint for space‑constrained designs.
- Regulatory readiness: RoHS compliance supports lead‑free manufacturing processes.
Why Choose XC7VX550T-2FFG1927I?
The XC7VX550T-2FFG1927I positions itself as a high‑capacity Virtex®‑7 XT FPGA option for designs that need extensive logic resources, significant embedded RAM, and a large number of I/O in a surface‑mount FCBGA package. Its industrial temperature rating and defined core voltage range make it suitable for systems that require stable operation across a wide thermal range.
With manufacturing by AMD and clear, verifiable specifications for logic capacity, memory, I/O, package, and environmental compliance, this device is aimed at customers who require substantial on‑chip integration and predictable electrical and thermal characteristics.
Request a quote or submit an inquiry to evaluate the XC7VX550T-2FFG1927I for your next design and receive pricing and availability details tailored to your requirements.

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