XC7VX550T-2FFG1158C

The XC7VX550T-2FFG1158C is a Virtex®-7 XT Field Programmable Gate Array (FPGA) from AMD, delivered in an FCBGA surface-mount package. It combines a large logic fabric with substantial on-chip memory and a high I/O count to address demanding programmable-logic designs.

Key device attributes include approximately 554,240 logic elements, roughly 43.5 Mbits of embedded memory, 350 I/O pins, a narrow core supply range (0.97 V to 1.03 V), and commercial-grade operation from 0 °C to 85 °C.

Key Features

• Core Logic – Approximately 554,240 logic elements (cells) provide extensive capacity for large-scale logic implementation and complex digital designs.
• Configurable Logic Blocks (CLBs) – About 43,300 CLBs available for flexible partitioning of logic and routing resources.
• Embedded Memory – Approximately 43.5 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without relying solely on external memory.
• I/O Capability – 350 user I/O pins to support multiple interfaces and high pin-count connectivity requirements.
• Power – Core voltage supply range of 0.97 V to 1.03 V to match tight power delivery requirements for the device.
• Package & Mounting – Surface-mount FCBGA package; package case listed as 1156-BBGA, FCBGA with supplier device package 1158-FCBGA (35×35), suitable for compact, high-density board layouts.
• Operating Range & Grade – Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance – RoHS compliant.

Typical Applications

• High-density programmable logic systems – Use the large logic element count and CLB resources for complex custom logic implementations and hardware acceleration.
• Data buffering and local memory tasks – Approximately 43.5 Mbits of embedded RAM supports on-chip storage for buffering and intermediate data processing.
• I/O-intensive interface aggregation – 350 I/O pins enable consolidation of multiple interfaces and high connection density on a single FPGA.
• Platform prototyping and system integration – Commercial-grade operation and surface-mount FCBGA packaging make the device suitable for development platforms and integrated system designs.

Unique Advantages

• Large on-chip logic capacity: With roughly 554,240 logic elements, the device supports complex designs without immediate need for partitioning across multiple FPGAs.
• Significant embedded memory: Approximately 43.5 Mbits of RAM reduces dependence on external memory components for many buffering and storage tasks.
• High I/O count: 350 I/O pins allow integration of multiple peripherals and interfaces directly to the FPGA, simplifying board-level interconnect.
• Compact, high-density package: FCBGA packaging and a 35×35 supplier footprint support dense PCB layouts and space-constrained designs.
• Narrow core supply range: A defined voltage window (0.97 V–1.03 V) aids in predictable power delivery and planning for the core supply rail.
• RoHS compliant commercial device: Meets RoHS requirements for environmentally conscious product designs within standard commercial temperature ranges.

Why Choose XC7VX550T-2FFG1158C?

The XC7VX550T-2FFG1158C positions itself as a high-capacity Virtex®-7 XT FPGA option for designs that require extensive logic resources, sizeable on-chip memory, and a large number of I/O connections. Its combination of approximately 554,240 logic elements, around 43.5 Mbits of embedded RAM, and 350 I/Os provides a strong foundation for consolidating functions that would otherwise require multiple components.

Targeted at commercial-grade applications operating from 0 °C to 85 °C, the device offers a compact FCBGA footprint and RoHS compliance for streamlined integration. Choose this FPGA when your design priorities include high integration density, substantial local memory, and broad I/O capability backed by the Virtex-7 product family.

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