XC7VX550T-1FFG1158C

The XC7VX550T-1FFG1158C is a Virtex®-7 XT field programmable gate array (FPGA) IC from AMD. It provides high logic capacity, significant embedded memory, and a large I/O count in a surface-mount FCBGA package suitable for compact board-level integration.

Key Features

• Core Logic — 554,240 logic elements (cells) enabling complex programmable logic implementations.
• Configurable Logic Blocks (CLBs) — 43,300 CLBs for partitioning and mapping of RTL to hardware resources.
• Embedded Memory — Approximately 43.5 Mbits of on-chip RAM to support data buffering, lookup tables, and intermediate storage.
• I/O Capacity — 350 I/O pins to support multi-channel interfacing and high-pin-count peripheral connectivity.
• Package & Mounting — 1156-BBGA / FCBGA package; supplier device package listed as 1158-FCBGA (35×35); surface mount for standard PCB assembly.
• Power — Core supply range from 0.970 V to 1.03 V for defined core-voltage operation.
• Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density digital systems — Deploy where large logic capacity (554,240 logic elements) is required to implement complex digital functions.
• Memory-intensive designs — Use the device’s approximately 43.5 Mbits of embedded memory for buffering, FIFOs, and on-chip data storage.
• Multi-channel I/O interfacing — Ideal for designs that need up to 350 I/O connections for sensors, peripherals, or high-channel-count interfaces.
• Compact board-level integration — The FCBGA package and surface-mount mounting suit dense PCB layouts and area-constrained designs.

Unique Advantages

• Large programmable fabric: 554,240 logic elements enable implementation of substantial custom logic without external FPGA partitioning.
• Significant on-chip memory: Approximately 43.5 Mbits of embedded RAM reduces dependence on external memory for many use cases.
• High I/O count: 350 I/Os provide flexibility for parallel interfaces and multi-channel connectivity.
• Compact, manufacturable package: 1156-BBGA/1158-FCBGA (35×35) with surface-mount mounting supports standard PCB assembly flows.
• Defined power window: Core voltage range of 0.970 V to 1.03 V supports controlled power budgeting and supply design.
• RoHS compliant: Meets environmental compliance requirements for lead-free assembly processes.

Why Choose XC7VX550T-1FFG1158C?

The XC7VX550T-1FFG1158C positions itself as a high-capacity Virtex®-7 XT FPGA option for designs that demand substantial logic resources, embedded memory, and a high number of I/O connections in a compact FCBGA package. Its combination of 554,240 logic elements, approximately 43.5 Mbits of on-chip RAM, and 350 I/Os makes it suitable for complex programmable logic implementations where board space and integration matter.

This device is well matched to development and production designs requiring commercial-grade operation (0 °C to 85 °C) and RoHS compliance, offering a balanced platform for high-density, memory-rich FPGA-based systems.

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