XC7VX485T-3FFG1158E

The XC7VX485T-3FFG1158E is a Virtex‑7 XT field programmable gate array offering very large logic capacity and substantial on‑chip memory for complex digital designs. As an FPGA in a BGA/FCBGA package, it targets applications that require significant programmable logic resources, high I/O count and extended operating conditions.

Key attributes include 485,760 logic elements, approximately 38 Mbits of embedded memory, 350 I/O, and an extended-grade operating range, delivering a compact, surface-mount solution for high-density FPGA implementations.

Key Features

• Logic Capacity  485,760 logic elements provide a large fabric for implementing complex logic, datapaths and custom hardware blocks.
• Embedded Memory  Approximately 38 Mbits of on‑chip RAM (Total Ram Bits: 37,969,920) for FIFOs, buffers and data storage close to logic.
• I/O Integration  350 user I/O pins support extensive external interfacing and parallel connectivity for peripherals and high-bandwidth links.
• Configurable Logic Resources  About 37,950 logic blocks to organize and map combinational and sequential resources efficiently across the device.
• Power Supply  Specified core supply range of 970 mV to 1.03 V to match system power requirements for the device core.
• Package & Mounting  Offered in FCBGA/1156-BBGA package case with supplier device package 1158-FCBGA (35×35); surface-mount package simplifies PCB integration.
• Operating Conditions  Extended grade with an operating temperature range of 0 °C to 100 °C, suitable for applications requiring extended thermal tolerance.
• Environmental Compliance  RoHS compliant for alignment with common environmental and manufacturing requirements.

Typical Applications

• High-density digital processing  Implement large-scale datapaths, parallel processors and custom logic using the device’s 485,760 logic elements and embedded memory.
• Custom hardware acceleration  Create hardware accelerators and offload compute‑intensive functions to the FPGA fabric, leveraging substantial on‑chip RAM for local buffering.
• I/O‑intensive designs  Systems that require many external connections can use the 350 I/O pins for interfacing with sensors, peripherals and external buses.

Unique Advantages

• Highly integrated logic and memory  Combines a large number of logic elements with approximately 38 Mbits of embedded RAM to reduce external memory needs.
• Extensive I/O capability  350 I/O pins provide headroom for parallel interfaces and complex board-level connectivity without extra bridge components.
• Compact surface-mount package  FCBGA/BBGA packaging (1156-BBGA / 1158-FCBGA (35×35)) enables dense board layouts and reliable soldered mounting.
• Extended-grade operation  Rated for 0 °C to 100 °C, supporting designs that require broader operating temperature tolerance.
• Regulatory alignment  RoHS compliance supports environmentally conscious manufacturing and assembly processes.

Why Choose XC7VX485T-3FFG1158E?

The XC7VX485T-3FFG1158E is positioned for designs that need substantial programmable logic capacity, significant embedded memory and a high I/O count in a compact, surface-mount package. Its combination of 485,760 logic elements, roughly 38 Mbits of on‑chip RAM and extended-grade operating range makes it suitable for complex, memory‑aware FPGA implementations.

Backed by the Virtex‑7 family documentation and AMD’s product resources, this device offers a scalable hardware platform for engineers building dense, I/O-rich programmable solutions where integration, configuration flexibility and RoHS compliance matter.

If you would like pricing, availability or to request a quote for the XC7VX485T-3FFG1158E, submit an inquiry or request a quote and our team will respond with details.