XC7VX485T-3FFG1157E

The XC7VX485T-3FFG1157E is a Virtex®-7 XT field programmable gate array (FPGA) in a ball-grid array package. It provides a high number of logic elements, substantial embedded RAM capacity, and a large I/O complement for designs that require significant programmable logic and memory resources.

Packaged for surface-mount assembly and rated for an extended grade operating range, this device combines dense logic and memory resources with a defined core voltage and operating temperature window to support deployment in a broad set of electronic systems.

Key Features

• Logic Capacity — 485,760 logic elements and 37,950 CLBs provide large programmable logic resource counts for complex designs.
• Embedded Memory — Approximately 38 Mbits of on-chip RAM (37,969,920 total RAM bits) for buffering, FIFO, and algorithmic storage needs.
• I/O Count — 600 programmable I/O pins to support wide peripheral connectivity and high-pin-count interfaces.
• Power and Core Voltage — Core supply voltage range specified from 970 mV to 1.03 V to match system power-rail planning.
• Package and Mounting — Surface-mount device available in 1156-BBGA, FCBGA; supplier device package listed as 1157-FCBGA (35×35).
• Operating Temperature and Grade — Extended grade with an operating temperature range of 0 °C to 100 °C.
• RoHS Compliance — RoHS compliant for regulatory and assembly considerations.

Unique Advantages

• High logic density: 485,760 logic elements and 37,950 CLBs enable implementation of large-scale logic functions and parallel processing blocks without external logic.
• Significant embedded memory: Approximately 38 Mbits of on-chip RAM reduces dependence on external memory for many buffering and data-path tasks.
• Large I/O capacity: 600 I/Os allow direct connection to multiple high-pin-count peripherals and interfaces, simplifying board-level routing.
• Defined core voltage envelope: A narrow supply range (970 mV–1.03 V) supports predictable power delivery design and voltage budgeting.
• Surface-mount BGA packaging: 1156-BBGA/1157-FCBGA packaging provides a compact, manufacturable footprint suitable for dense PCBs.
• Extended-grade operation: Specification for 0 °C to 100 °C operation aligns with a range of commercial and industrial-adjacent deployments.

Why Choose XC7VX485T-3FFG1157E?

The XC7VX485T-3FFG1157E positions itself as a high-capacity Virtex®-7 XT FPGA option for designs that demand extensive logic resources, substantial on-chip memory, and a large number of I/Os. Its defined core voltage range, extended-grade temperature rating, and BGA packaging provide clear mechanical and electrical characteristics for system integration.

This device is suited to engineering teams building complex programmable designs that require dense logic and embedded RAM within a surface-mount BGA form factor, offering a balance of integration and predictable operating parameters for production systems.

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