XC7VX485T-2FFG1930I
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 700 37969920 485760 1924-BBGA, FCBGA |
|---|---|
| Quantity | 549 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 17 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1930-FCBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1924-BBGA, FCBGA | Number of I/O | 700 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 37950 | Number of Logic Elements/Cells | 485760 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 37969920 |
Overview of XC7VX485T-2FFG1930I – Virtex®-7 XT Field Programmable Gate Array (FPGA) IC
The XC7VX485T-2FFG1930I is a Virtex®-7 XT field programmable gate array IC offering high-density programmable logic and on-chip memory in an industrial-grade package. Its architecture provides large logic capacity, substantial embedded RAM, and extensive I/O for complex digital designs in industrial and high-performance embedded systems.
With a wide operating temperature range and RoHS compliance, this surface-mount FCBGA device is intended for applications that require scalable programmable logic, significant memory resources, and many external interfaces.
Key Features
- Core Logic 485,760 logic elements provide high combinational and sequential resource capacity for complex FPGA implementations.
- Embedded Memory Approximately 38 Mbits of on-chip RAM support large buffering, lookup tables, and data storage for algorithm acceleration.
- I/O Density 700 I/O pins enable extensive external interfacing for multi-channel systems and high-pin-count board designs.
- Power Supply Operates with a core voltage range of 970 mV to 1.03 V to match system power architectures and regulator designs.
- Package & Mounting Packaged in a 1924-BBGA FCBGA with a supplier device package of 1930-FCBGA (45×45); designed for surface-mount assembly.
- Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for temperature-demanding environments.
- Compliance RoHS compliant, supporting environmentally conscious manufacturing and end-product requirements.
Typical Applications
- Industrial Control & Automation Use the device’s high logic and I/O counts to implement complex control algorithms, motion control, and machine interface logic.
- High-Performance Signal Processing Leverage the large logic fabric and approximately 38 Mbits of embedded RAM for real-time data processing, filtering, and aggregation functions.
- Multi-Interface System Integration 700 I/O pins enable consolidation of multiple interfaces and sensors into a single programmable device for system-level integration.
Unique Advantages
- High logic density: 485,760 logic elements enable implementation of large, integrated digital functions without distributed external logic.
- Substantial on-chip memory: Approximately 38 Mbits of embedded RAM reduce the need for external memory in many buffering and state-storage use cases.
- Extensive I/O capability: 700 I/O pins facilitate broad connectivity for multi-channel and multi-protocol designs.
- Industrial temperature range: Operation from −40 °C to 100 °C supports deployment in temperature-challenging environments.
- Surface-mount FCBGA package: The 1924-BBGA / 1930-FCBGA (45×45) packaging supports high-density PCB implementations and standard SMT assembly flows.
- Regulatory alignment: RoHS compliance simplifies integration into regulated manufacturing processes and product lines.
Why Choose XC7VX485T-2FFG1930I?
The XC7VX485T-2FFG1930I positions itself as a high-capacity, industrial-grade FPGA solution combining large programmable logic resources, significant embedded memory, and a high I/O count in a compact FCBGA package. It is well suited for designers who need to consolidate complex digital functions, large buffering, and many external interfaces into a single programmable device.
For teams focused on long-term, scalable designs, this Virtex®-7 XT device offers a balance of integration and environmental robustness, backed by clear electrical and thermal operating ranges to plan board-level power and thermal solutions around.
Request a quote or submit an inquiry to get pricing and availability for the XC7VX485T-2FFG1930I and to discuss how it can fit your next FPGA-based design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
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Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








