XC7VX485T-2FFG1761I

The XC7VX485T-2FFG1761I is a Virtex®-7 XT Field Programmable Gate Array designed for high-density, I/O-rich industrial applications. It delivers a large programmable fabric with 485,760 logic elements and approximately 38 Mbits of embedded memory, along with up to 700 general-purpose I/Os for complex interfacing.

Built for surface-mount deployment in a 1760-BBGA (1761-FCBGA, 42.5×42.5 mm) package and rated for industrial temperature operation, this device targets designs requiring substantial logic capacity, significant on-chip RAM, and robust I/O connectivity while operating within a 0.97–1.03 V core supply range.

Key Features

• Programmable Logic Capacity — 485,760 logic elements to implement large-scale digital designs and complex logic structures.
• Embedded Memory — Approximately 38 Mbits of on-chip RAM to support buffering, LUT-based storage, and local data processing.
• I/O Density — Up to 700 I/O pins for broad interfacing options with external peripherals, sensors, and transceivers.
• Power Supply — Core voltage range of 970 mV to 1.03 V to match system power rails and ensure deterministic core operation.
• Package and Mounting — 1760-BBGA (supplier package 1761-FCBGA, 42.5×42.5 mm) in a surface-mount form factor for board-level integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
• RoHS Compliant — Conforms to RoHS environmental requirements for lead-free assembly.

Typical Applications

• Industrial Control and Automation — High logic capacity and industrial temperature rating support complex control algorithms, real-time processing, and dense I/O for factory equipment and automation systems.
• I/O-Intensive Systems — With up to 700 I/Os, the device is suited for applications requiring extensive peripheral interfacing, sensor aggregation, or multi-channel data acquisition.
• Signal Processing and Data Aggregation — Large embedded memory and significant logic resources enable buffering, preprocessing, and custom data-path implementations.

Unique Advantages

• Large-Scale Integration: 485,760 logic elements provide the capacity to consolidate multiple functions into a single programmable device, reducing board-level BOM complexity.
• Substantial On-Chip Memory: Approximately 38 Mbits of embedded RAM allows for local data storage and high-throughput processing without immediate external memory dependence.
• High I/O Count: Up to 700 I/Os enable extensive external connectivity and flexible interfacing for multi-channel designs.
• Industrial Robustness: Rated for −40 °C to 100 °C operation, suitable for industrial deployments that require extended temperature tolerance.
• Package Density: 1760-BBGA (1761-FCBGA, 42.5×42.5 mm) surface-mount package supports compact board layouts while accommodating a high pin count.
• Regulatory Compliance: RoHS compliance supports lead-free assembly processes and environmental requirements.

Why Choose XC7VX485T-2FFG1761I?

The XC7VX485T-2FFG1761I positions itself as a high-capacity, industrial-grade FPGA option for designs that demand extensive logic resources, significant embedded memory, and a large number of I/Os in a compact surface-mount package. Its core voltage range and industrial temperature rating make it suitable for robust, long-life applications where in-system flexibility and integration are priorities.

Designers and system integrators who need to consolidate multiple functions onto a single programmable device will find the combination of logic density, on-chip RAM, and connectivity beneficial for scalable and maintainable designs backed by a well-known FPGA product family from AMD.

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