XC7VX485T-2FFG1761C

The XC7VX485T-2FFG1761C is a Virtex®-7 XT Field Programmable Gate Array (FPGA) IC from AMD. It delivers 485,760 logic elements, approximately 38 Mbits of embedded memory, and support for up to 700 I/Os in a 1760-BBGA FCBGA package.

Designed for applications that require large logic capacity, substantial on-chip RAM, and high I/O density, this commercial-grade, surface-mount device operates with a supply range of 0.97 V to 1.03 V and an ambient temperature range of 0 °C to 85 °C.

Key Features

• Core Logic 485,760 logic elements to implement large-scale digital designs and complex user logic.
• Embedded Memory Approximately 38 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• I/O Density Up to 700 general-purpose I/Os for high-pin-count interfaces and multi-channel connectivity.
• Power and Supply Operates with a core voltage supply range of 970 mV to 1.03 V to match system power rails.
• Packaging and Mounting 1760-BBGA, FCBGA package (supplier package: 1761-FCBGA, 42.5 × 42.5 mm) for surface-mount assembly and high-density board layouts.
• Commercial Temperature Grade Specified for an operating temperature range of 0 °C to 85 °C for commercial applications.
• Regulatory RoHS compliant.

Typical Applications

• High-density digital signal processing — Use the large logic element count and embedded RAM to implement complex DSP algorithms and streaming data pipelines.
• Test and measurement equipment — High I/O count and substantial on-chip memory enable multi-channel data acquisition and real-time processing.
• Communications infrastructure — Leverage the device’s logic capacity and I/O resources for protocol handling, packet processing, and interface aggregation.
• Prototyping and advanced system integration — The surface-mount FCBGA package and commercial-grade thermal range support dense board designs and lab/development environments.

Unique Advantages

• High logic capacity: 485,760 logic elements allow larger functions and more parallelism without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 38 Mbits of embedded RAM reduces external memory dependency and simplifies board-level BOM.
• Extensive I/O support: Up to 700 I/Os provide flexibility for multi-channel interfaces and complex system connectivity.
• Compact, high-density package: 1760-BBGA (1761-FCBGA, 42.5 × 42.5 mm) enables dense PCB implementations while retaining high pin count.
• Commercial-grade availability: Specified operating temperature and RoHS compliance support standard commercial deployments and procurement.

Why Choose XC7VX485T-2FFG1761C?

The XC7VX485T-2FFG1761C is positioned for designs that demand significant logic resources, ample embedded memory, and a high number of I/Os in a single FPGA package. Its combination of 485,760 logic elements, approximately 38 Mbits of on-chip RAM, and 700 I/Os makes it suitable for complex digital systems where integration and channel density matter.

For development teams and procurement managers seeking a commercial-grade, surface-mount FPGA with a compact FCBGA footprint and clear electrical and thermal parameters, this Virtex-7 XT device provides a scalable platform that simplifies board design and supports advanced system integration.

Request a quote or submit an inquiry for XC7VX485T-2FFG1761C to receive availability, pricing, and lead-time information tailored to your design and procurement needs.