XC7VX485T-2FFG1157C

The XC7VX485T-2FFG1157C is a Virtex®-7 XT Field Programmable Gate Array (FPGA) from AMD, provided in a high-density FCBGA/BBGA package. It combines a large logic capacity, substantial on-chip memory, and a high I/O count to address complex digital designs that require significant integration and parallel processing resources.

Targeted at commercial-grade applications, this device is suited for designs that need hundreds of thousands of logic elements, tens of megabits of embedded RAM, and broad external connectivity while operating within a standard commercial temperature range.

Key Features

• Logic Capacity 485,760 logic elements provide substantial programmable logic resources for complex and highly parallel designs.
• Embedded Memory Approximately 38 Mbits of on-chip RAM support buffering, large FIFOs, and embedded data storage for demanding logic functions.
• I/O Count 600 user I/O pins enable extensive external interfacing for multi-channel systems and dense peripheral connectivity.
• Power Supply Core supply range of 970 mV to 1.03 V, compatible with typical FPGA core voltage requirements.
• Package and Mounting Surface-mount device offered in 1156-BBGA, FCBGA package configurations; supplier device package listed as 1157-FCBGA (35×35) for board-level integration.
• Operating Grade and Temperature Commercial grade with an operating temperature range of 0°C to 85°C for standard commercial deployments.
• Environmental Compliance RoHS compliant to meet common regulatory requirements for lead-free assembly.

Typical Applications

• High-density digital systems — Use the device’s large logic capacity and embedded memory to consolidate multiple functions into a single FPGA for reduced board complexity.
• Signal processing and communications — High logic and memory resources enable implementation of parallel data paths, buffering, and protocol handling for communications equipment.
• Data aggregation and I/O-intensive systems — The 600 I/O pins support systems that require broad external connectivity and multi-channel interfacing.

Unique Advantages

• High logic density: 485,760 logic elements allow designers to implement large, complex functions without multiple FPGAs.
• Substantial on-chip memory: Approximately 38 Mbits of embedded RAM reduce reliance on external memory for buffering and temporary storage.
• Extensive I/O capability: 600 I/O pins support diverse peripheral connections and multi-channel designs, simplifying board-level routing.
• Compact FCBGA package options: Surface-mount BBGA/FCBGA packages enable dense board placement and integration in space-constrained designs.
• Commercial temperature rating: Rated 0°C to 85°C for typical commercial deployments in controlled environments.
• RoHS compliant: Conforms to lead-free assembly requirements for modern manufacturing processes.

Why Choose XC7VX485T-2FFG1157C?

Designed by AMD, the XC7VX485T-2FFG1157C positions itself as a high-capacity, commercially graded Virtex-7 XT FPGA suitable for complex digital designs that demand significant programmable logic, embedded memory, and I/O resources. Its combination of 485,760 logic elements, approximately 38 Mbits of on-chip RAM, and 600 I/Os provides the capacity and flexibility to consolidate system functions and simplify board-level architectures.

This device is a strong fit for teams building high-density, I/O-rich commercial systems that require robust on-chip resources and surface-mount package options. Its electrical and thermal characteristics support integration into standard commercial product lifecycles while enabling scalable designs that can leverage the device’s large internal resources.

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