XC7VX485T-1FFG1930I

The XC7VX485T-1FFG1930I is a Virtex®-7 XT field programmable gate array (FPGA) optimized for high-density digital designs. It integrates 485,760 logic elements and approximately 38 Mbits of embedded memory to support complex logic functions and on-chip data storage.

With up to 700 I/O, an industrial operating temperature range (−40 °C to 100 °C), and a core supply range of 970 mV to 1.03 V, this device is targeted at systems that require substantial logic capacity, significant embedded memory, and extensive I/O connectivity in a surface-mount FCBGA/BBGA package.

Key Features

• Core Logic  485,760 logic elements provide a large fabric for implementing complex, parallel digital functions.
• Embedded Memory  Approximately 38 Mbits of on-chip RAM for data buffering, state storage, and accelerator memory needs.
• I/O Capacity  Up to 700 I/O pins to support broad connectivity and interfacing with external devices and subsystems.
• Power  Core voltage supply range of 970 mV to 1.03 V to match system power architectures and VCCINT requirements.
• Package Options  Available in 1924-BBGA and 1930-FCBGA (45×45) surface-mount packages to suit board-level integration and mechanical constraints.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital processing  Use the large logic fabric and embedded memory to implement complex state machines, data-path accelerators, and custom compute cores.
• I/O-intensive systems  Leverage up to 700 I/O pins for broad sensor, interface, or multi-channel data acquisition and distribution tasks.
• Industrial control and automation  Industrial temperature rating and robust packaging make the device suitable for control systems requiring extended temperature operation.

Unique Advantages

• Extensive logic capacity: 485,760 logic elements enable large-scale integration of digital functions on a single device, reducing external component count.
• Substantial on-chip memory: Approximately 38 Mbits of embedded RAM supports local buffering and state retention without relying on external memory.
• High I/O density: 700 I/O pins provide flexible connectivity for complex board-level interfaces and mixed-signal front ends.
• Industrial-ready operation: Rated for −40 °C to 100 °C to address applications requiring extended temperature performance.
• Flexible packaging: Choice of 1924-BBGA and 1930-FCBGA (45×45) surface-mount packages supports different assembly and mechanical requirements.
• Controlled core supply: Narrow core voltage range (970 mV to 1.03 V) simplifies power-down rails and regulator selection for consistent operation.

Why Choose XC7VX485T-1FFG1930I?

The XC7VX485T-1FFG1930I offers a combination of large logic resources, significant embedded memory, and extensive I/O in industry-grade packaging, making it well suited for designers who need high integration and robust operation across temperature. Its surface-mount BBGA/FCBGA package options and RoHS compliance support production-scale deployment while preserving board-level flexibility.

This part is appropriate for engineers building complex digital systems that require high on-chip capacity and reliable operation in demanding environments, delivering scalability and integration that can simplify system architecture and reduce bill-of-materials complexity.

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