XC7VX485T-1FFG1927C
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 600 37969920 485760 1924-BBGA, FCBGA |
|---|---|
| Quantity | 55 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1927-FCBGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1924-BBGA, FCBGA | Number of I/O | 600 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 37950 | Number of Logic Elements/Cells | 485760 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 37969920 |
Overview of XC7VX485T-1FFG1927C – Virtex®-7 XT FPGA, 1924-BBGA FCBGA
The XC7VX485T-1FFG1927C is a Virtex®-7 XT field programmable gate array (FPGA) IC optimized for high-density, I/O‑rich digital designs. It combines a large logic capacity with substantial on‑chip memory and a high pin count in a compact FCBGA package.
This commercial-grade FPGA is suited to designs that require significant programmable logic, embedded memory resources and extensive I/O connectivity while operating within standard commercial temperature and voltage ranges.
Key Features
- Logic Capacity 485,760 logic elements provide a large fabric for implementing complex digital functions and system integration.
- Embedded Memory Approximately 38 Mbits of on‑chip RAM enable local buffering, lookup tables and memory‑intensive algorithms without external memory for some functions.
- I/O Resources 600 user I/O pins support extensive peripheral interfacing, wide buses and multi‑channel connectivity in a single device.
- Power and Core Voltage Core supply range of 0.97 V to 1.03 V enables defined power planning for system design and voltage rail integration.
- Package & Mounting 1924‑BBGA (FCBGA) package, supplier device package 1927‑FCBGA (45×45), configured for surface‑mount assembly to support high‑pin‑count board designs.
- Operating Conditions Commercial grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant for environmental conformance.
Typical Applications
- High‑density digital systems Implement complex logic functions and system integration where a large number of logic elements are required.
- Memory‑intensive processing Use the device’s approximately 38 Mbits of embedded RAM for buffers, FIFO structures and on‑chip data storage.
- I/O‑rich interface designs Deploy the 600 I/O pins for multi‑channel data acquisition, sensor interfaces, or wide parallel buses.
- Compact board integration Leverage the 1924‑BBGA FCBGA surface‑mount package for dense PCB layouts requiring a high pin count.
Unique Advantages
- High logic density: 485,760 logic elements allow consolidation of multiple functions into a single FPGA, reducing system component count.
- Significant on‑chip memory: Approximately 38 Mbits of embedded RAM reduce dependency on external memory for many buffering and storage tasks.
- Extensive I/O capability: 600 user I/O pins provide flexibility for interfacing with peripherals, sensors and wide data paths without additional multiplexing.
- Compact, manufacturable package: The FCBGA package and surface‑mount mounting support dense PCB implementations and standard assembly processes.
- Commercial operating range: Rated 0 °C to 85 °C and RoHS compliant for deployment in commercial applications with defined environmental requirements.
Why Choose XC7VX485T-1FFG1927C?
The XC7VX485T-1FFG1927C positions itself as a high‑capacity FPGA option for designers who need a combination of large programmable logic, sizable embedded memory and broad I/O in a compact FCBGA package. Its specifications make it appropriate for commercial applications that demand on‑chip resources and high pin‑count integration.
For teams building scalable digital systems, the device delivers the integration needed to reduce board‑level complexity and consolidate functions while providing predictable operating and power characteristics for system planning.
Request a quote or submit a purchase inquiry to receive pricing, availability and support information for the XC7VX485T-1FFG1927C.

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