XC7VX485T-1FFG1761C

The XC7VX485T-1FFG1761C is a Virtex®-7 XT family Field Programmable Gate Array (FPGA) from AMD designed for designs requiring large logic capacity, substantial embedded memory, and high I/O density. Its architecture supports complex, high‑density digital designs through a combination of 485,760 logic elements and approximately 38 Mbits of on‑chip RAM.

Packaged in a 1760‑BBGA (supplier package 1761‑FCBGA, 42.5 × 42.5 mm) and specified for commercial operating temperatures, this surface‑mount device offers a defined core voltage range and a high I/O count for demanding board‑level implementations.

Key Features

• Core Logic — 485,760 logic elements provide large programmable logic capacity for complex digital functions and custom hardware acceleration.
• Embedded Memory — Approximately 38 Mbits of on‑chip RAM to support buffering, FIFOs, and on‑device data storage for high‑throughput designs.
• High I/O Count — 700 I/O pins enable connectivity for wide data buses, multi‑channel interfaces, and large peripheral arrays.
• Power — Core supply range of 970 mV to 1.03 V allows precise power provisioning for the FPGA core.
• Package & Mounting — 1760‑BBGA (1761‑FCBGA, 42.5 × 42.5 mm) in a surface‑mount format suited to compact, high‑pin‑count PCB layouts.
• Temperature & Grade — Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High‑density digital logic — Use the 485,760 logic elements to implement complex custom logic, protocol processing, and hardware acceleration within a single device.
• On‑device buffering and data handling — Approximately 38 Mbits of embedded memory support large buffers, data aggregation, and streaming applications.
• High‑pin‑count systems — 700 I/Os enable integration with multiple peripherals, wide buses, and multi‑channel interfaces on densely populated PCBs.

Unique Advantages

• Large programmable capacity: 485,760 logic elements reduce the need for multiple devices by consolidating complex logic into a single FPGA.
• Significant on‑chip memory: Approximately 38 Mbits of RAM provide internal storage for buffering and state retention, lowering external memory dependency.
• Extensive I/O connectivity: 700 I/O pins simplify board design for high‑channel or high‑bandwidth systems without external multiplexing.
• Compact, high‑pin package: 1760‑BBGA (1761‑FCBGA, 42.5 × 42.5 mm) balances a small PCB footprint with high connectivity for dense designs.
• Defined power window: Core supply range of 970 mV–1.03 V enables predictable power design and supply sequencing.
• Commercial‑grade qualification: Rated for 0 °C to 85 °C operation to meet standard commercial application environments.

Why Choose XC7VX485T-1FFG1761C?

The XC7VX485T-1FFG1761C positions itself as a high‑capacity FPGA solution for designs that demand large logic resources, substantial embedded memory, and a high number of I/Os in a single surface‑mount package. Its combination of 485,760 logic elements, approximately 38 Mbits of on‑chip RAM, and 700 I/Os supports consolidation of complex subsystems and reduces board‑level partitioning.

This device is suited to engineering teams and procurement groups developing commercial temperature‑range digital systems where integration density, predictable power requirements, and RoHS compliance are important considerations.

Request a quote or submit a procurement inquiry to receive pricing, availability, and lead‑time information for the XC7VX485T-1FFG1761C.