XC7VX485T-1FFG1158I

The XC7VX485T-1FFG1158I is a Virtex®-7 XT Field Programmable Gate Array (FPGA) IC from AMD, designed to provide a large programmable fabric in a surface-mount FCBGA package. It delivers substantial on-chip resources, including 485,760 logic elements and approximately 38 Mbits of embedded memory, for designs that require high logic density and significant internal RAM.

With 350 user I/O pins, an industrial operating range, and a low-voltage core supply window, this device targets applications that need dense logic, abundant embedded memory, and broad temperature tolerance.

Key Features

• Logic Capacity  Approximately 485,760 logic elements and 37,950 CLBs provide large programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 38 Mbits of on-chip RAM to support data buffering, state storage, and memory-intensive functions within the FPGA fabric.
• I/O  350 user I/O pins to accommodate multi-channel interfaces and signal routing requirements in dense system designs.
• Power  Core voltage supply range of 0.97 V to 1.03 V for the programmable fabric.
• Package and Mounting  1156-BBGA / FCBGA package (supplier device package listed as 1158-FCBGA, 35×35) in a surface-mount form factor suitable for standard PCB assembly processes.
• Operating Temperature and Grade  Industrial grade device rated for operation from −40 °C to 100 °C.
• Manufacturer  Produced by AMD as part of the Virtex‑7 family.

Typical Applications

• High-density digital systems  Use the large logic capacity and on-chip memory to implement complex custom digital functions and control logic within a single programmable device.
• I/O-rich interfacing  With 350 I/O pins, the device is suitable for designs requiring multiple external interfaces, signal routing, or board-level integration of many peripherals.
• Industrial control and instrumentation  Industrial grade operation from −40 °C to 100 °C enables deployment in systems that require extended temperature tolerance.

Unique Advantages

• High logic density: Large logic element count (485,760) and 37,950 CLBs allow consolidation of complex functions that would otherwise require multiple devices.
• Significant on-chip memory: Approximately 38 Mbits of embedded RAM reduces dependence on external memory for many buffering and state storage needs.
• Generous I/O count: 350 user I/O pins support multi-channel designs and extensive board-level connectivity without additional bridge components.
• Industrial temperature capability: Rated from −40 °C to 100 °C to suit applications with wider environmental requirements.
• Compact surface-mount package: 1156-BBGA / supplier 1158-FCBGA (35×35) packaging provides a high-density solution for space-constrained PCBs.

Why Choose XC7VX485T-1FFG1158I?

The XC7VX485T-1FFG1158I combines a very large logic fabric, substantial embedded memory, and a high I/O count in a surface-mount FCBGA package, making it appropriate for designs that need to integrate many functions into a single FPGA. Its industrial operating range and specified core voltage window support deployment in systems with temperature and power constraints.

This device is suited for teams and projects that require scalable logic capacity and on-chip RAM while maintaining a compact board footprint and broad I/O capability. As a member of the Virtex‑7 family from AMD, it provides a defined set of silicon attributes for designers specifying high-density programmable logic.

Request a quote or submit a procurement inquiry today to get pricing and availability for the XC7VX485T-1FFG1158I.