XC7VX485T-1FF1927C

The XC7VX485T-1FF1927C is a Virtex®-7 XT field programmable gate array (FPGA) IC offered in a 1924-BBGA / FCBGA package. It delivers a very large logic capacity and extensive I/O for dense programmable logic implementations.

With 485,760 logic elements, approximately 38 Mbits of embedded memory and 600 I/O pins, this device targets high-density, high-I/O designs that require substantial on-chip RAM and flexible system interfacing within a commercial temperature range.

Key Features

• Core Capacity  485,760 logic elements to support complex programmable logic and large-scale design integration.
• Embedded Memory  Approximately 38 Mbits of total on-chip RAM bits for buffering, data storage and intermediate processing tasks.
• I/O  600 user I/O pins to accommodate wide parallel interfaces, multi-channel data paths and extensive peripheral connections.
• Power  Nominal core voltage range from 970 mV to 1.03 V to match system power-rail requirements and core power planning.
• Package & Mounting  Available in 1924-BBGA / FCBGA package; supplier device package listed as 1927-FCBGA (45×45). Surface-mount mounting type simplifies PCB assembly for high-density boards.
• Temperature & Grade  Commercial grade device rated for operation from 0°C to 85°C.
• Compliance  RoHS-compliant, meeting standard lead-free environmental requirements.

Typical Applications

• High-density signal processing  Large logic capacity and substantial embedded memory support complex signal processing pipelines and parallel compute tasks.
• Data aggregation and routing  Extensive I/O count enables multiple high-bandwidth interfaces and flexible data fan-in/fan-out architectures.
• Prototyping and system integration  Generous logic and memory resources allow integration of multiple subsystems and rapid design iteration on a single FPGA platform.

Unique Advantages

• Large logic fabric: 485,760 logic elements provide the headroom needed for complex state machines, parallel algorithms and multi-function designs.
• Significant on-chip memory: Approximately 38 Mbits of embedded RAM reduces reliance on external memory for mid-sized buffering and local data storage.
• High I/O density: 600 I/O pins simplify board-level routing and reduce the need for external multiplexing or expanders.
• Compact FCBGA package: 1924-BBGA / 1927-FCBGA (45×45) options support high-density board layouts while maintaining surface-mount assembly compatibility.
• Commercial temperature range: Rated 0°C to 85°C for applications and environments that operate within standard commercial limits.
• RoHS compliant: Meets common environmental requirements for lead-free manufacturing processes.

Why Choose XC7VX485T-1FF1927C?

The XC7VX485T-1FF1927C combines very large logic capacity, substantial embedded memory and a high I/O count in a surface-mount FCBGA package, making it well suited to dense programmable logic designs that need on-chip resources and broad interfacing capability within a commercial temperature range. Its power supply range and packaging details provide the concrete electrical and mechanical parameters engineers require for system planning.

This device is appropriate for design teams and procurement focused on scalable FPGA implementations where integration density, on-chip memory and I/O availability are primary selection criteria.

Request a quote or submit a pricing inquiry for XC7VX485T-1FF1927C to evaluate availability and lead time for your design requirements.