XC7VX415T-2FFV1158C

The XC7VX415T-2FFV1158C is a Virtex®-7 XT field programmable gate array from AMD, delivered in a high-density FCBGA package. It provides a large logic fabric combined with substantial embedded RAM and a broad I/O count for complex, reconfigurable digital designs.

Designed for commercial-grade systems, this surface-mount FPGA integrates 412,160 logic elements, approximately 32.44 Mbits of embedded memory, and 350 I/O pins, enabling compact integration of sizable custom logic functions within a 1156-BBGA/FCBGA footprint.

Key Features

• Core Logic  412,160 logic elements to implement large-scale custom digital functions and system-level accelerators.
• Embedded Memory  Approximately 32.44 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic blocks.
• I/O Density  350 general-purpose I/O pins to support wide data buses and multiple peripheral interfaces directly on-chip.
• Power Supply  Operates with core supply between 0.970 V and 1.030 V, aligning with modern FPGA power domains.
• Package and Mounting  Available in 1156-BBGA FCBGA package; supplier device package listed as 1158-FCBGA (35×35). Surface-mount construction for board-level integration.
• Operating Range  Commercial-grade operating temperature from 0 °C to 85 °C for typical commercial applications.
• Compliance  RoHS-compliant construction for regulatory and environmental alignment.

Typical Applications

• System Prototyping and Custom Logic  Leverage the 412,160 logic elements and extensive on-chip memory to prototype and implement complex custom datapaths and control logic.
• High-Density I/O Interfaces  Use the 350 I/O pins for dense interface requirements such as wide parallel buses, multiple peripheral connections, or board-level prototyping.
• Embedded Memory-Intensive Functions  Approximately 32.44 Mbits of embedded RAM supports buffering, frame storage, and memory-backed state machines within a single device.
• Compact Board Integration  FCBGA surface-mount packaging (1156-BBGA / supplier 1158-FCBGA 35×35) enables integration of high-capacity programmable logic into space-constrained commercial designs.

Unique Advantages

• Large Logic Capacity: The device's 412,160 logic elements enable consolidation of multiple functions into one FPGA, reducing board-level component count.
• Substantial On-Chip Memory: Approximately 32.44 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks, simplifying BOM and layout.
• High I/O Count: 350 I/O pins support complex interfacing and high-bandwidth connections without additional I/O expanders.
• Standard Commercial Grade: 0 °C to 85 °C operating range matches common commercial application requirements and system environments.
• RoHS Compliant: Environmentally compliant construction supports regulatory and manufacturing requirements.

Why Choose XC7VX415T-2FFV1158C?

The XC7VX415T-2FFV1158C positions itself as a high-capacity, commercially graded FPGA option from AMD, combining hundreds of thousands of logic elements with tens of megabits of embedded RAM and a broad I/O complement. Its FCBGA packaging and surface-mount form factor permit integration into dense boards while maintaining the flexibility of reprogrammable logic.

This device is well suited for engineering teams and product designers who need substantial on-chip resources for complex logic, memory-backed functions, and dense interfacing within commercial-temperature systems. The combination of capacity, I/O, and package options offers scalability and integration benefits for long-term designs supported by AMD's product ecosystem.

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