XC7VX415T-2FFG1927I

The XC7VX415T-2FFG1927I is a Virtex®-7 XT Field Programmable Gate Array (FPGA) supplied in an FCBGA package. It delivers a high-capacity programmable logic fabric with substantial on-chip memory and extensive I/O for demanding industrial designs.

With 32,200 configurable logic blocks (CLBs), approximately 412,160 logic elements, approximately 32.44 Mbits of embedded memory, and up to 600 I/O pins, this device is aimed at applications that require high integration density, large memory resources, and broad I/O connectivity while operating across an industrial temperature range.

Key Features

• Programmable Logic Capacity  32,200 CLBs and approximately 412,160 logic elements provide significant logic resources for complex digital designs.
• Embedded Memory  Approximately 32.44 Mbits of on-chip RAM to support large buffers, queues, and state storage directly within the FPGA fabric.
• I/O Density  Up to 600 I/O pins to support high-port-count interfaces and extensive connectivity requirements.
• Package and Mounting  Offered in a 1924-BBGA FCBGA package with supplier device package 1927-FCBGA (45×45); surface-mount construction for board-level integration.
• Power Supply Range  Core voltage specified from 0.970 V to 1.03 V for defined power-domain design and supply planning.
• Operating Temperature  Industrial-grade operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Regulatory  RoHS compliant to support lead-free assembly and regulatory requirements.

Unique Advantages

• High integration density: Large counts of CLBs and logic elements enable consolidation of complex functions into a single device, reducing system-level component count.
• Substantial on-chip memory: Approximately 32.44 Mbits of embedded RAM minimizes external memory dependency and supports high-throughput buffering and stateful processing.
• Extensive I/O availability: 600 I/O pins provide flexibility for multi-channel interfaces and mixed-signal front-end connectivity.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in industrial and other temperature-demanding applications.
• Surface-mount FCBGA packaging: High-density package options (1924-BBGA / 1927-FCBGA 45×45) support compact board layouts and high-pin-count routing.
• RoHS compliant: Meets lead-free manufacturing requirements for modern assembly processes.

Why Choose XC7VX415T-2FFG1927I?

The XC7VX415T-2FFG1927I balances substantial programmable logic, large embedded memory, and high I/O count in an industrial-grade FPGA package. It is well suited to engineers and system designers who need to implement complex, high-density digital functions with significant on-chip buffering and broad interface support while adhering to industrial temperature requirements.

Its combination of logic resources, memory capacity, and package options provides scalability and integration potential for multi-function platforms, helping reduce board-level components and simplifying system architectures.

Request a quote or submit a procurement inquiry to get pricing and availability for the XC7VX415T-2FFG1927I.